Method of manufacturing capacitor, method of manufacturing organic light emitting display device including the capacitor, and organic light emitting display device manufactured by using the method
US-9112188-B2 · Aug 18, 2015 · US
US10005263B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10005263-B2 |
| Application number | US-201514814059-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2015 |
| Priority date | Feb 26, 2015 |
| Publication date | Jun 26, 2018 |
| Grant date | Jun 26, 2018 |
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A display device may include a first substrate, a lower barrier layer disposed on a rear surface of the first substrate, an upper barrier layer disposed on a front surface of the first substrate, a display structure disposed on the upper barrier layer, and a second substrate disposed on the display structure.
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What is claimed is: 1. A method of manufacturing a display device, the method comprising: forming a barrier layer on a support substrate; forming a first substrate on the barrier layer; forming an upper barrier layer on a front surface the first substrate; forming a display structure on the upper barrier layer; separating the first substrate from the support substrate using a laser irradiation process; and forming a lower barrier layer on a rear surface of the first substrate. 2. The method of claim 1 , wherein a laser is irradiated into the barrier layer through the support substrate in the laser irradiation process. 3. The method of claim 2 , wherein the lower barrier layer comprises a portion of the barrier layer remaining on the rear surface of the first substrate after the laser irradiation process. 4. The method of claim 2 , wherein a laser ablation depth of the barrier layer by the laser corresponds to an energy density of the laser. 5. The method of claim 2 , wherein the barrier layer comprises a single layer structure. 6. The method of claim 5 , wherein the barrier layer comprises silicon nitride or silicon oxynitride. 7. The method of claim 5 , wherein the upper barrier layer comprises a multi layer structure. 8. The method of claim 7 , wherein forming the upper barrier layer comprises alternately stacking silicon oxide films and silicon nitride films on the front surface of the first substrate. 9. The method of claim 4 , wherein a thickness of the lower barrier layer is a difference between an entire thickness of the barrier layer and the laser ablation depth of the barrier layer. 10. The method of claim 9 , wherein the thickness of the lower barrier layer is adjusted in accordance with the energy density of the laser. 11. The method of claim 10 , wherein the energy density of the laser is adjusted in accordance with a hydrogen content of the barrier layer. 12. The method of claim 11 , wherein the hydrogen content of the barrier layer is adjusted in accordance with relative flow rates of a silane (SiH 4 ) gas, an ammonia (NH 3 ) gas, and an oxygen (O 2 ) gas.
using laser · CPC title
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Inorganic coating · CPC title
specially treated, e.g. irradiated · CPC title
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