Support structures for additive manufacturing techniques

US10005239B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10005239-B2
Application numberUS-201514812762-A
CountryUS
Kind codeB2
Filing dateJul 29, 2015
Priority dateJul 29, 2015
Publication dateJun 26, 2018
Grant dateJun 26, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A support structure for an additive manufacturing system includes a support body with a support body material and an interface disposed on the support body with an interface material. The interface material has a ductile-to-brittle transition temperature that is higher than the ductile-to-brittle temperature of the support body material for selectively fracturing the interface material to separate an additively manufactured article from the support body.

First claim

Opening claim text (preview).

What is claimed is: 1. A support structure, comprising: a support body including a support body material; and an interface layer disposed over the support body and including an interface material, wherein the interface material has a ductile-brittle transition temperature that is higher than a ductile-brittle transition temperature of the support body material for separating three-dimensional articles formed on the interface material. 2. The support structure as recited in claim 1 , wherein the article includes a plurality of layers fused over top one another using a selective laser sintering process, an electron beam melting process, or an electron beam sintering process. 3. The support structure as recited in claim 1 , wherein the interface material has a resistance that is lower than a resistance of the support body material. 4. The support structure as recited in claim 3 , further including an article coupled to the interface layer with a resistance that is less than the resistance of the interface material. 5. The support structure as recited in claim 1 , further including source and drain leads connected to the interface layer. 6. The support structure as recited in claim 5 , wherein the source lead, the interface layer, and the drain lead form a resistive heating element. 7. The support structure as recited in claim 1 , further including an article coupled to the support structure by the interface layer, wherein the article has a ductile-to-brittle transition temperature lower than the ductile-to-brittle transition temperature of the interface material. 8. The support structure as recited in claim 1 , wherein the interface material includes carbon steel with an embrittlement constituent added to promote fracture of the interface layer. 9. The support structure as recited in claim 8 , wherein the embrittlement component at least one of oxygen, nitrogen, sulfur, and phosphorous. 10. The support structure as recited in claim 8 , wherein the embrittlement constituent includes a precipitate disposed at grain boundaries within a crystalline structure of the interface material. 11. The support structure as recited in claim 8 , wherein the embrittlement constituent includes at least one of an impurity, a non-metallic inclusion, and an intermetallic constituent. 12. The support structure as recited in claim 8 , wherein the embrittlement constituent includes an iron-nitride precipitate. 13. A method of separating an additively manufactured article from a support structure including a support body with a support body material, the method comprising: heating an interface layer coupling an article constructed by layer wise addition of layers on the interface layer, wherein the interface layer is disposed over the support body and includes an interface material, wherein the interface material has a ductile-brittle transition temperature that is higher than a ductile-brittle transition temperature of the support body material; and cooling the interface layer such that the interface layer fractures, wherein cooling the interface layer includes cooling the interface layer to a temperature that is below the ductile-to brittle transition temperature of a material forming the interface layer. 14. The method as recited in claim 13 , wherein cooling the interface layer includes cooling the interface layer to a temperature that is (a) above a ductile-to-brittle transition temperature of a material included in the support structure, and (b) above a ductile-to-brittle transition temperature of a material included in the article. 15. The method as recited in claim 13 , wherein heating the interface layer includes resistively heating the interface layer to a temperature that is above the blue brittleness temperature of a material forming the interface layer.

Assignees

Inventors

Classifications

  • B29C64/153Primary

    using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • characterised by material · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • Data acquisition or data processing for additive manufacturing · CPC title

  • for holding or positioning work · CPC title

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Frequently asked questions

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What does patent US10005239B2 cover?
A support structure for an additive manufacturing system includes a support body with a support body material and an interface disposed on the support body with an interface material. The interface material has a ductile-to-brittle transition temperature that is higher than the ductile-to-brittle temperature of the support body material for selectively fracturing the interface material to separ…
Who is the assignee on this patent?
Delavan Inc, Delavan Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/153. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).