Structure stamp, device and method of embossing

Patent metadata

Field	Value
Publication number	US-10005225-B2
Application number	US-201214425657-A
Country	US
Kind code	B2
Filing date	Sep 6, 2012
Priority date	Sep 6, 2012
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A structure stamp with a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, an embossing element drive for moving an embossing element along the structure stamp.

First claim

The invention claimed is:

1. A structure stamp, comprising:
a flexible stamp having a microstructured or nanostructured stamp surface, the stamp surface being positioned opposite a substrate on which embossing material has been applied, the flexible stamp being configured to emboss a structure on the substrate by immersing the stamp surface in the embossing material, the embossed structure corresponding with the stamp surface;
a frame configured to clamp the flexible stamp; and
an embossing element configured to apply a line force to the flexible stamp to expand the flexible stamp toward the substrate beyond a surface plane E, the surface plane E being defined by a top surface of the frame.

2. The structure stamp as claimed in claim 1 , wherein the flexible stamp is clamped on at least two opposing clamping sides of the frame, the clamping side being located on opposite sides of the frame.

3. The structure stamp as claimed in claim 1 , wherein the frame has two guide strips which run opposite and parallel to each other, the guide strips being configured to guide the embossing element along an exposure side of the flexible stamp that faces away from the stamp surface.

4. The structure stamp as claimed in claim 3 , wherein the surface plane E is further defined by the guide strips.

5. The structure stamp as claimed in claim 1 , wherein the flexible stamp is formed from a carrier and an elastomer stamp layer that is hot-embossed or molded onto the carrier.

6. The structure stamp as claimed in claim 1 , further comprising a retaining frame that accommodates the frame on its side facing away from the stamp surface.

7. The structure stamp as claimed in claim 2 , wherein the embossing element is guided between the retaining frame and the frame and parallel to the opposing clamping sides.

8. The stamp as claimed in claim 1 , wherein the line force is applied by the embossing element to an exposure side of the flexible stamp that faces away from the stamp surface.

9. A device for embossing structure on a substrate, said device comprising:
a structure stamp, comprising:
a flexible stamp having a microstructured or nanostructured stamp surface, the stamp surface being positioned opposite the substrate on which embossing material has been applied, the flexible stamp being configured to emboss the structure on the substrate by immersing the stamp surface in the embossing material, the embossed structure corresponding with the stamp surface;
a frame configured to clamp the flexible stamp; and
an embossing element configured to apply a line force to the flexible stamp to expand the flexible stamp toward the substrate beyond a surface plane E, the surface plane E being defined by a top surface of the frame;

a stamp receiver configured to accommodate and move the structure stamp; and
an embossing element drive configured to move the embossing element along the structure stamp to apply the line force to the flexible stamp.

10. The device as claimed in claim 9 , wherein the line force is applied by the embossing element to an exposure side of the flexible stamp that faces away from the stamp surface.

11. A method for embossing a structure on a substrate, the method comprising:
applying an embossing material on the substrate;
placing a microstructured or nanostructured stamp surface of a flexible stamp of a structure stamp opposite the substrate;
clamping the flexible stamp using a frame; and
embossing the structure on the substrate by moving an embossing element along the structure stamp to apply a line force to the flexible stamp in order to expand the flexible stamp toward the substrate beyond a surface plane E and immerse the stamp surface in the embossing material, the surface plane E being defined by a top surface of the frame,
wherein the embossed structure corresponds with the stamp surface.

12. The method as claimed in claim 11 , wherein the the surface plane E is further defined by the guide strips.

13. The method as claimed in claim 11 , wherein the frame on its side facing away from the stamp surface is accommodated by a retaining frame.

14. The method as claimed in claim 13 , wherein the embossing element is guided along the flexible stamp, between the retaining frame and the frame, and parallel to clamping sides of the frame that oppose each other.

15. The method as claimed in claim 11 , wherein the line force is applied by the embossing element to an exposure side of the flexible stamp that faces away from the stamp surface.

Assignees

• Fischer Peter
• Kreindl Gerald
• Harming Jakob
• Thanner Christine
• Schoen Christian
• Ev Group E Thallner Gmbh

Inventors

• Fischer Peter
• Kreindl Gerald
• Harming Jakob
• Thanner Christine
• Schön Christian

Classifications

• B29C59/002

  Component parts, details or accessories; Auxiliary operations · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• B29C2059/023

  Microembossing · CPC title

• G03F7/0017

  for the production of embossing, cutting or similar devices; for the production of casting means · CPC title

• B29C59/022 Primary

  characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title