Systems and methods for real-time monitoring of micromilling tool wear

US10005167B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10005167-B2
Application numberUS-201715823804-A
CountryUS
Kind codeB2
Filing dateNov 28, 2017
Priority dateFeb 6, 2014
Publication dateJun 26, 2018
Grant dateJun 26, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The wear status of a micro-endmill tool may be inferred by monitoring the chip production rate of the tool in operation. Chips may be extracted from a work area, captured on an adhesive surface, imaged, and counted to determine the chip production rate. When the rate of chip production falls, the feed rate of the micro-endmill may be modified to a level suitable for the current state of tool wear. In this manner, costly and inconvenient work stoppages to evaluate the wear status of a tool are eliminated.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for monitoring wear of a micromilling tool, the method comprising: determining an initial chip production rate; extracting, via a skirt, a tube coupled to the skirt, and a pump coupled to the tube, chips produced during operation of the micromilling tool; depositing, from a nozzle coupled to the tube, the chips on adhesive tape; moving, via a conveyor belt, the adhesive tape to bring the chips into the field of view of a camera; acquiring, via the camera, an image of the chips on the adhesive tape; counting, by an image processing system, the chips in the image to determine a current chip production rate; and calculating, using the initial chip production rate and the current chip production rate, the wear status of the micromilling tool. 2. The method of claim 1 , further comprising adjusting, responsive to the calculating the wear status, a feed rate associated with the micromilling tool. 3. The method of claim 2 , wherein, as the chip count decreases, the feed rate of the micro-endmill is increased. 4. The method of claim 1 , wherein the counting, by the image processing system, the chips in the image comprises: converting the image of the chips to grayscale; thresholding the image of the chips to remove excessive lustre; equalizing a histogram of the image of the chips to improve contrast; thresholding the image of the chips to identify a background grayscale level; converting the image of the chips to black and white; eroding the image of the chips to reduce pixelated errors; performing edge detection on the image of the chips to form edges therein; performing dilation on the image of the chips to connect at least a portion of the edges; filling a component in the image of the chips arising from the edge detection; and counting the chips appearing in the image of the chips. 5. The method of claim 1 , further comprising pausing operation of the conveyor belt during the time the camera acquires the image of the chips. 6. The method of claim 1 , wherein an outlet of the nozzle has an inner diameter at least four times larger than the inner diameter of the tube at the location the tube is coupled to the skirt. 7. The method of claim 1 , wherein a bottom of the skirt is disposed within 1 mm of a workpiece in order to provide airflow into the interior of the skirt while still containing chips produced within the skirt. 8. The method of claim 1 , wherein the airspeed in the tube at the location where the tube couples to the skirt exceeds 200 meters per second. 9. The method of claim 1 , wherein the airspeed at an exit of the nozzle is less than 15 meters per second. 10. The method of claim 1 , wherein the width of the adhesive tape is at least twice the inner diameter of the nozzle. 11. The method of claim 1 , wherein the outlet of the nozzle is disposed between about 0.1 inches and about 0.25 inches above the surface of the adhesive tape. 12. The method of claim 1 , further comprising increasing the feed rate of the micro-endmill when the current chip production rate falls below 60% of the initial chip production rate. 13. The method of claim 1 , wherein the pump is a vacuum pump. 14. The method of claim 13 , wherein the vacuum pump supplies a static vacuum of 400 mbar at 7 bar supply pressure. 15. The method of claim 1 , wherein the moving the chips via the conveyor belt is performed at a speed of between 0.5 meters per minute and 20 meters per minute. 16. The method of claim 1 , wherein: the adhesive tape has a first adhesive disposed on a first side of the adhesive tape; the adhesive tape has a second adhesive disposed on a second side of the adhesive tape; the first adhesive is stronger than the second adhesive; and the chips are deposited on the first side of the adhesive tape.

Assignees

Inventors

Classifications

  • Monitoring tool breakage, life or condition · CPC title

  • Calculate wear from workpiece and tool material, machining operations · CPC title

  • with product handling or receiving means · CPC title

  • before or after machining · CPC title

  • for measuring features or for detecting a condition of machine parts, tools or workpieces (B23Q17/2428, B23Q17/2433 take precedence) · CPC title

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What does patent US10005167B2 cover?
The wear status of a micro-endmill tool may be inferred by monitoring the chip production rate of the tool in operation. Chips may be extracted from a work area, captured on an adhesive surface, imaged, and counted to determine the chip production rate. When the rate of chip production falls, the feed rate of the micro-endmill may be modified to a level suitable for the current state of tool we…
Who is the assignee on this patent?
Univ Arizona State, Arizon Board Of Regents On Behalf Of Arizona State Univ
What technology area does this patent fall under?
Primary CPC classification G05B19/4065. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).