Power conversion device

Patent metadata

Field	Value
Publication number	US-10003274-B2
Application number	US-201414909577-A
Country	US
Kind code	B2
Filing date	Aug 6, 2014
Priority date	Sep 18, 2013
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A power conversion device includes: a metal housing; a power semiconductor module that is contained in the metal housing and converts direct electric current to alternating electric current; a capacitor module that is contained in the metal housing and arranged side by side with the power semiconductor module, wherein the capacitor module smoothes the direct electric current supplied to the power semiconductor module; a substrate that has a drive circuit part mounted in a first region, the drive circuit part driving the power semiconductor module, and a control circuit part mounted in a second region, the control circuit part controlling the drive circuit part, wherein the substrate is disposed so as to cover over the metal housing; a base plate that extends in a space in which the second region of the substrate and the capacitor module oppose to each other, and that is electrically connected to the metal housing; and a first noise shielding member that extends in a direction along a boundary between the first region and the second region of the substrate, wherein the first noise shielding member separates the space from a space of the housing in which the power semiconductor module is disposed, and the first noise shielding member is electrically connected to the metal housing or a ground of the control circuit part.

First claim

The invention claimed is:

1. A power conversion device, comprising:
a metal housing;
a power semiconductor module that is contained in the metal housing and converts direct electric current to alternating electric current;
a capacitor module that is contained in the metal housing and arranged side by side with the power semiconductor module, wherein the capacitor module smoothes the direct electric current supplied to the power semiconductor module;
a substrate that has a drive circuit part mounted in a first region, the drive circuit part driving the power semiconductor module, and a control circuit part mounted in a second region, the control circuit part controlling the drive circuit part, wherein the substrate is disposed so as to cover over the metal housing;
a base plate that extends in a space in which the second region of the substrate and the capacitor module oppose to each other, and that is electrically connected to the metal housing; and
a first noise shielding member that extends in a direction along a boundary between the first region and the second region of the substrate, wherein the first noise shielding member separates the space from a space of the housing in which the power semiconductor module is disposed, and the first noise shielding member is electrically connected to the metal housing or a ground of the control circuit part, wherein
the first noise shielding member is integrally formed with the base plate,
one surface of the substrate opposes to the power semiconductor module and the capacitor module, while another surface opposes to a metal lid member that covers an opening part of the housing,
the power conversion device further comprises a second noise shielding member that is provided so as to oppose to the other surface of the substrate between the first region and the second region, and
the second noise shielding member is electrically connected to at least one of the ground of the control circuit part mounted on the substrate, and the lid member.

2. The power conversion device according to claim 1 , wherein:
the first noise shielding member is electrically connected to the ground of the control circuit part mounted on the second region.

3. The power conversion device according to claim 1 , wherein:
the second noise shielding member is fixed to the substrate.

4. The power conversion device according to claim 1 , wherein:
the second noise shielding member projects from the lid member.

5. The power conversion device according to claim 1 , further comprising:
a third noise shielding member that is provided so as to oppose to the other surface of the substrate in a space in which the second region and the lid member oppose to each other, wherein an extension line in an extension direction of the third noise shielding member intersects the second noise shielding member, wherein:
the third noise shielding member is electrically connected to at least one of the ground of the control circuit part mounted on the substrate, and the lid member.

6. The power conversion device according to claim 5 , wherein:
the third noise shielding member is fixed to the substrate.

7. The power conversion device according to claim 5 , wherein:
the third noise shielding member projects from the lid member.

8. A power conversion device, comprising:
a metal housing;
a power semiconductor module that is contained in the metal housing and converts direct electric current to alternating electric current;
a capacitor module that is contained in the metal housing and arranged side by side with the power semiconductor module, wherein the capacitor module smoothes the direct electric current supplied to the power semiconductor module;
a substrate that has a drive circuit part mounted in a first region, the drive circuit part driving the power semiconductor module, and a control circuit part mounted in a second region, the control circuit part controlling the drive circuit part, wherein the substrate is disposed so as to cover over the metal housing, with one of both surfaces of the substrate opposing to the power semiconductor module and the capacitor module;
a lid member that is a metal member covering an opening part of the housing and opposes to another surface that is opposite to the one surface of the substrate;
a base plate that extends in a space in which the second region of the substrate and the capacitor module oppose to each other, and that is electrically connected to the metal housing;
a first noise shielding member that extends in a direction along a boundary between the first region and the second region of the substrate, wherein the first noise shielding member separates a space in which the other surface of the substrate and the lid member oppose to each other into a first space in which the first region and the lid member oppose to each other and a second space in which the second region and the lid member oppose to each other, and the first noise shielding member is electrically connected to at least one of a ground of the control circuit part mounted in the second region and the lid member; and
a second noise shielding member that is provided in the second space in which the second region and the lid member oppose to each other, wherein an extension line in an extension direction of the second noise shielding member intersects the first noise shielding member, and the second noise shielding member is electrically connected to at least one of the ground of the control circuit part mounted in the second region and the lid member.

9. The power conversion device according to claim 8 , wherein:
the extension line of the second noise shielding member is orthogonal to the first noise shielding member.

10. The power conversion device according to claim 8 , wherein:
a plurality of second noise shielding members, each identical to the second noise shielding member, are provided.

11. The power conversion device according to claim 10 , wherein:
the plurality of the second noise shielding members are arranged in parallel to each other.

12. The power conversion device according to claim 10 , wherein:
two second noise shielding members are provided and a clearance between the two second noise shielding members becomes narrower toward the first noise shielding member.

13. The power conversion device according to claim 10 , wherein:
two the second noise shielding members are provided and a clearance between the two second noise shielding members becomes wider toward the first noise shielding member.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Takahashi Masayoshi
• Fukumasu Keisuke
• Fujita Yuki
• Kato Takeshi
• Funato Hiroki

Classifications

• H05K5/04

  Metal casings · CPC title

• H05K9/002

  with localised screening · CPC title

• H05K5/0026

  provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units · CPC title

• H02M7/003 Primary

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K7/1432

  specially adapted for power drive units or power converters · CPC title