Magnetic tunnel junction with an improved tunnel barrier

US10002973B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10002973-B2
Application numberUS-201213604035-A
CountryUS
Kind codeB2
Filing dateSep 5, 2012
Priority dateSep 9, 2011
Publication dateJun 19, 2018
Grant dateJun 19, 2018

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Abstract

Official abstract text for this publication.

The present disclosure concerns a method of fabricating a magnetic tunnel junction suitable for a magnetic random access memory (MRAM) cell and comprising a first ferromagnetic layer, a tunnel barrier layer, and a second ferromagnetic layer, comprising: forming the first ferromagnetic layer; forming the tunnel barrier layer; and forming the second ferromagnetic layer; wherein said forming the tunnel barrier layer comprises depositing a layer of metallic Mg; and oxidizing the deposited layer of metallic Mg such as to transform the metallic Mg into MgO; the step of forming the tunnel barrier layer being performed at least twice such that the tunnel barrier layer comprises at least two layers of MgO.

First claim

Opening claim text (preview).

The invention claimed is: 1. Method of fabricating a magnetic tunnel junction suitable for a magnetic random access memory (MRAM) cell and comprising a first ferromagnetic layer, a tunnel barrier layer, and a second ferromagnetic layer, comprising: forming the first ferromagnetic layer comprising elements from the group consisting of cobalt CO, iron Fe, boron B, and nickel Ni; depositing a first additional CoFe layer after forming the first ferromagnetic layer; forming the tunnel barrier layer; depositing a second additional CoFe layer prior to forming the second ferromagnetic layer; and forming the second ferromagnetic layer comprising elements from the group consisting of cobalt Co, iron Fe, boron B, and nickel Ni, such that the magnetic tunnel junction comprises the first additional CoFe layer between the first ferromagnetic layer and the tunnel barrier layer and the second additional CoFe layer between the tunnel barrier layer and the second ferromagnetic layer; said forming the tunnel barrier layer comprising the steps of: depositing a first layer of metallic Mg, subsequent to the deposition of the first layer of metallic Mg, oxidizing the deposited first layer of metallic Mg such as to transform the first layer of metallic Mg into a first layer of MgO, subsequent to transforming the first layer into MgO, depositing a second layer of metallic Mg on the first layer of MgO, and subsequent to depositing the second layer of metallic Mg, oxidizing the deposited second layer of metallic Mg such as to transform the second layer of metallic Mg into a second layer of MgO; whereby the steps of forming MgO layers are performed more than twice such that the tunnel barrier layer comprises more than two layers of MgO so as to reduce the probability of the barrier layer comprising pinholes which are aligned through all the MgO layers, wherein the steps of depositing the layer of metallic Mg further comprises using an inert gas such as to level the deposited layer of metallic Mg, the deposited layer of metallic Mg is between 0.3 nm and 1.2 nm. 2. The method according to claim 1 , wherein the thickness of the deposited layer of metallic Mg is comprised between 0 nm and 1.5 nm and preferably between 0.3 nm and 1.2 nm. 3. The method according to claim 1 , further comprising depositing an additional layer of metallic Mg prior and after forming the tunnel barrier layer. 4. The method of claim 1 , wherein said Mg layer does not contain oxygen while being deposited using the inert gas. 5. The method of claim 4 , where oxygen is introduced for performing said oxidation only after the layer of Mg is deposited. 6. The method of claim 1 , where oxygen is introduced for performing said oxidation only after the layer of Mg is deposited. 7. Method of fabricating a magnetic tunnel junction suitable for a magnetic random access memory (MRAM) cell and comprising a first ferromagnetic layer, a tunnel barrier layer, and a second ferromagnetic layer, comprising: forming the first ferromagnetic layer comprising elements from the group consisting of cobalt Co, iron Fe, boron B and nickel Ni; depositing a first additional CoFe layer after forming the first ferromagnetic layer; forming the tunnel barrier layer by performing method including the steps of: depositing a first layer of metallic Mg using an inert gas resulting in the layer of metallic Mg forming without oxygen doping, subsequent to the deposition of the first layer of metallic Mg, introducing oxygen for oxidizing the deposited first layer of metallic Mg such as to transform the metallic Mg into MgO, depositing a second layer of metallic Mg on the first layer of MgO, and subsequent to depositing the second layer of metallic Mg, oxidizing the deposited second layer of metallic Mg such as to transform the second layer of metallic Mg into a second layer of MgO; whereby the steps of forming MgO layers are performed at least twice such that the tunnel barrier layer comprises a plurality of layers of MgO so as to reduce the probability of the barrier layer comprising pinholes which are aligned through all the MgO layers; depositing a second additional CoFe layer prior to forming the second ferromagnetic layer; and forming the second ferromagnetic layer comprising elements from the group consisting of cobalt Co, iron Fe, boron B and nickel Ni, such that the magnetic tunnel junction comprises the first additional CoFe layer between the first ferromagnetic layer and the tunnel barrier layer and the second additional CoFe layer between the tunnel barrier layer and the second ferromagnetic layer. 8. The method according to claim 5 , wherein the thickness of the deposited layer of metallic Mg is comprised between 0 nm and 1.5 nm and preferably between 0.3 nm and 1.2 nm. 9. The method according to claim 5 , further comprising depositing a CoFe layer after said forming the first ferromagnetic layer and prior said forming the second ferromagnetic layer. 10. The method according to claim 5 , further comprising depositing an additional layer of metallic Mg prior and after forming the tunnel barrier layer. 11. Method of fabricating a magnetic tunnel junction suitable for a magnetic random access memory (MRAM) cell and comprising a first ferromagnetic layer, a tunnel barrier layer, and a second ferromagnetic layer, comprising: forming the first ferromagnetic layer comprising elements from the group consisting of cobalt Co, iron Fe, boron B and nickel Ni; depositing a first additional CoFe layer after forming the first ferromagnetic layer; forming the tunnel barrier layer; depositing a second additional CoFe layer prior to forming the second ferromagnetic layer; and forming the second ferromagnetic layer comprising elements from the group consisting of cobalt Co, iron Fe, boron B and nickel Ni, such that the magnetic tunnel junction comprises the first additional CoFe layer between the first ferromagnetic layer and the tunnel barrier layer and the second additional CoFe layer between the tunnel barrier layer and the second ferromagnetic layer; said forming the tunnel barrier layer comprising the steps of: depositing a first layer of metallic Mg, subsequent to the deposition of the first layer of metallic Mg, oxidizing the deposited first layer of metallic Mg such as to transform the first layer of metallic Mg into a first layer of MgO, subsequent to transforming the first layer into MgO, depositing a second layer of metallic Mg on the first layer of MgO, and subsequent to depositing the second layer of metallic Mg, oxidizing the deposited second layer of metallic Mg such as to transform the second layer of metallic Mg into a second layer of MgO; whereby the steps of forming MgO layers are performed more than twice such that the tunnel barrier layer comprises more than two layers of MgO so as to reduce the probability of the barrier layer comprising pinholes which are aligned through all the MgO layers, wherein depositing the layer of metallic Mg further comprises using an inert gas such as to level the deposited layer of metallic Mg. 12. Method of fabricating a magnetic tunnel junction suitable for a magnetic random access memory (MRAM) cell and comprising a first ferromagnetic layer, a tunnel barrier layer, and a second ferromagnetic layer, comprising: forming the first ferromagnetic layer comprising elements from the group consisting of cobalt Co, iron Fe, boron B and nickel Ni; depositing a first additional CoFe layer after forming the first ferromagnetic layer; forming the tunnel barrier layer; depositing a second additional CoFe layer prior to forming the second ferromagnetic layer; and forming the second ferromag

Assignees

Inventors

Classifications

  • Formation of materials, e.g. in the shape of layers or pillars · CPC title

  • Writing or programming circuits or methods · CPC title

  • G01R33/098Primary

    comprising tunnel junctions, e.g. tunnel magnetoresistance sensors · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

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What does patent US10002973B2 cover?
The present disclosure concerns a method of fabricating a magnetic tunnel junction suitable for a magnetic random access memory (MRAM) cell and comprising a first ferromagnetic layer, a tunnel barrier layer, and a second ferromagnetic layer, comprising: forming the first ferromagnetic layer; forming the tunnel barrier layer; and forming the second ferromagnetic layer; wherein said forming the t…
Who is the assignee on this patent?
Prejbeanu Ioan Lucian, Portemont Celine, Ducruet Clarisse, and 1 more
What technology area does this patent fall under?
Primary CPC classification G01R33/098. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 19 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).