Atomic layer deposition of selected molecular clusters

Patent metadata

Field	Value
Publication number	US-10002938-B2
Application number	US-201414464604-A
Country	US
Kind code	B2
Filing date	Aug 20, 2014
Priority date	Aug 20, 2013
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

Energy bands of a thin film containing molecular clusters are tuned by controlling the size and the charge of the clusters during thin film deposition. Using atomic layer deposition, an ionic cluster film is formed in the gate region of a nanometer-scale transistor to adjust the threshold voltage, and a neutral cluster film is formed in the source and drain regions to adjust contact resistance. A work function semiconductor material such as a silver bromide or a lanthanum oxide is deposited so as to include clusters of different sizes such as dimers, trimers, and tetramers, formed from isolated monomers. A type of Atomic Layer Deposition system is used to deposit on semiconductor wafers molecular clusters to form thin film junctions having selected energy gaps. A beam of ions contains different ionic clusters which are then selected for deposition by passing the beam through a filter in which different apertures select clusters based on size and orientation.

First claim

The invention claimed is:

1. A transistor formed on a substrate, the transistor comprising:
a source region;
a drain region;
a channel region extending between the source region and the drain region;
a metal gate region including a metal gate that includes a conductive metal portion;
contacts that couple the source region, the drain region, and the metal gate to a multi-layer metal interconnect structure; and
a molecular cluster thin film contacting the conductive metal portion of the metal gate, the molecular cluster thin film comprising nanoscale molecular clusters including at least two bonded atoms that are different, the nanoscale molecular clusters having a selected atomic structure that determines an electrical characteristic of the transistor, the molecular cluster thin film being between the conductive metal portion of the metal gate and the channel region.

2. The transistor of claim 1 wherein the molecular cluster thin film includes one or more of monomers, dimers, trimers, and tetramers.

3. The transistor of claim 1 wherein the molecular cluster thin film is a work function metal film within the metal gate region, and the electrical characteristic is a threshold voltage at which the transistor is activated.

4. The transistor of claim 1 wherein the contacts comprise metal-insulator-semiconductor contacts to the source region and the drain region, the metal-insulator-semiconductor contacts including the molecular cluster thin film, and wherein the electrical characteristic is contact resistance.

5. The transistor of claim 1 wherein the molecular cluster thin film includes one or more of silver bromide (Ag x Br y ), lanthanum oxide (La x O y ) and titanium oxide (Ti x O y ).

6. The transistor of claim 1 wherein the nanoscale molecular clusters have a size of less than 0.5 nm.

7. The transistor of claim 1 wherein the metal gate and the contacts are recessed below a surface of the substrate.

8. The transistor of claim 1 wherein the molecular cluster thin film is an ionic molecular thin film, and wherein the nanoscale molecular clusters are ionic nanoscale molecular clusters.

9. The transistor of claim 8 , further comprising a neutral molecular cluster thin film in the source region and the drain region, wherein the neutral molecular thin film comprises neutral nanoscale molecular clusters.

10. The transistor of claim 9 wherein the neutral nanoscale molecular clusters have a selected spatial orientation.

11. The transistor of claim 8 wherein the ionic nanoscale molecular clusters are positively charged.

12. The transistor of claim 8 wherein the ionic nanoscale molecular clusters have a selected spatial orientation.

13. An n-type semiconductor device, comprising:
a silicon substrate having an oxide layer buried therein;
a negatively-doped source region;
a negatively-doped drain region;
a channel through which current flows between the negatively-doped source region and the negatively-doped drain region;
a neutral molecular cluster thin film in the negatively-doped source region and the negatively-doped drain region, the neutral molecular cluster thin film comprising neutral molecular clusters;
a metal gate region comprising a metal gate capacitively coupled to the channel so as to control the current, the metal gate including a conductive metal portion;
an ionic molecular cluster thin film contacting the conductive metal portion of the metal gate, the ionic molecular cluster thin film comprising ionic molecular clusters, the molecular cluster thin film being between the conductive metal portion of the metal gate and the channel; and
metal-insulator-semiconductor contacts to the source region and the drain region.

14. The n-type semiconductor device of claim 13 wherein the neutral molecular clusters have a selected spatial orientation.

15. The n-type semiconductor device of claim 13 wherein the ionic molecular clusters impart a tensile stress at a silicon/germanium interface in the channel.

16. A p-type semiconductor device, comprising:
a silicon substrate having an oxide layer buried therein;
a positively-doped source region;
a positively-doped drain region;
a channel through which current flows between the positively-doped source region and the positively-doped drain region, the channel having a strained silicon interface;
a metal gate region comprising a metal gate capacitively coupled to the channel so as to control the current, the metal gate including a conductive metal portion and a dielectric portion;
a molecular cluster thin film contacting the conductive metal portion of the metal gate region, the molecular cluster thin film being between the conductive metal portion and the dielectric portion of the first metal gate structure, the molecular cluster thin film comprising ionic clusters; and
contacts to the positively-doped source region and the positively-doped drain region.

17. The p-type semiconductor device of claim 16 wherein the ionic clusters have a selected spatial orientation.

18. The p-type semiconductor device of claim 16 wherein the ionic clusters impart a compressive stress at the strained silicon interface in the channel.

19. A device, comprising:
a metal thin film, including a plurality of ionic clusters having a selected spatial orientation;
a semiconductor substrate;
a transistor on the semiconductor substrate, the transistor having a channel and a metal gate above the channel, the metal gate including a conductive metal material, the metal thin film being in contact with the conductive metal material of the metal gate of the transistor, the metal thin film being between the conductive metal material of the metal gate and the channel.

20. The device of claim 19 wherein a surface of the semiconductor substrate is electrically charged.

21. A device, comprising:
a substrate; and
a first transistor on the substrate, the first transistor including:
a first source;
a first drain;
a first metal gate structure that includes a conductive metal portion and a dielectric portion; and
a first molecular cluster thin film in contact with the conductive metal portion of the first metal gate structure, the first molecular cluster thin film being between the conductive metal portion and the dielectric portion of the first metal gate structure.

22. The device of claim 21 wherein the first transistor includes a channel that extends between the first source and first drain, the first metal gate structure being on the channel.

23. The device of claim 22 wherein the first molecular cluster thin film is in contact with a bottom surface and sides surfaces of the conductive metal portion of the first metal gate structure.

24. The device of claim 21 , further comprising:
a second transistor on the substrate, the second transistor including:
a second source;
a source contact;
a second drain;
a drain contact;
a second metal gate structure;
a second molecular cluster thin film in contact with the source contact and is between the source contact and the second source; and
a third molecular cluster thin film in contact with the drain contact and is between the drain contact and the second drain.

25. The device of claim 24 wherein the second and third molecular cluster thin film include molecular clusters of the same structure.

26. The device of claim 24 wherein a structure of the first molecular cluster thin film is different

Assignees

• St Microelectronics Inc

Inventors

• Zhang John H

Classifications

• H10P14/3402 Primary

  characterised by the chemical composition · CPC title

• H10P14/44

  Physical vapour deposition [PVD] · CPC title

• H10P14/42

  using a gas or vapour · CPC title

• H10P14/22

  using physical deposition, e.g. vacuum deposition or sputtering · CPC title

• H10D64/01318

  the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN (comprising a layer of alloys of Si, Ge or C H10D64/01314) · CPC title