Power transistor module

Patent metadata

Field	Value
Publication number	US-10002858-B2
Application number	US-201415325784-A
Country	US
Kind code	B2
Filing date	Jul 15, 2014
Priority date	Jul 15, 2014
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A first conductive pattern includes: a first feeding point for supplying a potential to the first conductive pattern located at one end thereof; one or more diode elements located over the first conductive pattern; and a plurality of switching elements over the first conductive pattern on the opposite side to the first feeding point with the diode elements in between. A second conductive pattern includes a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern. The plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires. The second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern.

First claim

The invention claimed is:

1. A power transistor module including one or more circuit boards in which a plurality of semiconductor elements is placed over a principal surface of an insulated substrate,
wherein the circuit board includes:
a first conductive pattern formed over the insulated substrate; and
a second conductive pattern formed in a region over the insulated substrate different from the region of the first conductive pattern such that the second conductive pattern is electrically insulated from the first conductive pattern,
wherein the first conductive pattern includes:
a first feeding point for supplying a potential to the first conductive pattern located at one end thereof;
one or more diode elements located over the first conductive pattern;
a plurality of switching elements located over the first conductive pattern on the opposite side to the first feeding point with the diode elements in between,
wherein the second conductive pattern includes:
a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern,
wherein the plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires,
wherein the second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern, and
wherein a slit width of the slit pattern is monotonically increased as it goes farther away from the second feeding point in the second conductive pattern.

2. A power transistor module including one or more circuit boards in which a plurality of semiconductor elements is placed over a principal surface of an insulated substrate,
wherein the circuit board includes:
a first conductive pattern formed over the insulated substrate; and
a second conductive pattern that is formed in a region over the insulated substrate different from the region of the first conductive pattern such that the second conductive pattern is electrically insulated from the first conductive pattern,
wherein the first conductive pattern includes:
a first feeding point for supplying a potential to the first conductive pattern located at one end thereof; and
a plurality of switching elements arranged along the direction from the first feeding point toward an end of the first conductive pattern on the opposite side to the end where the first feeding point is provided,
wherein the second conductive pattern includes a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern,
wherein the plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires,
wherein the second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern, and
wherein a slit width of the slit pattern is monotonically increased as it goes farther away from the second feeding point in the second conductive pattern.

3. A power transistor module including one or more circuit boards in which a plurality of semiconductor elements is placed over a principal surface of an insulated substrate,
wherein the circuit board includes:
a first conductive pattern formed over the insulated substrate; and
a second conductive pattern formed in a region over the insulated substrate different from the region of the first conductive pattern such that the second conductive pattern is electrically insulated from the first conductive pattern,
wherein the first conductive pattern includes:
a first feeding point for supplying a potential to the first conductive pattern located at one end thereof;
one or more diode elements located over the first conductive pattern;
a plurality of switching elements located over the first conductive pattern on the opposite side to the first feeding point with the diode elements in between,
wherein the second conductive pattern includes:
a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern,
wherein the plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires,
wherein the second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern, and
wherein the slit pattern is formed in a U shape within the second conductive pattern and the area of connection of the plurality of the bonding wires with the second conductive pattern is provided in an area enclosed with the U-shaped slit pattern and a side of the second conductive pattern on the opposite side to a side thereof in proximity to the second feeding point.

4. The power transistor module according to claim 1 ,
wherein the slit pattern is formed in an L shape within the second conductive pattern and the area of connection of the plurality of the bonding wires with the second conductive pattern is provided in an area enclosed with the L-shaped slit pattern and two sides of the second conductive pattern including a side of the second conductive pattern on the opposite side to a side thereof in proximity to the second feeding portion.

5. The power transistor module according to claim 1 ,
wherein the plurality of the switching elements is placed over the first conductive pattern along the longitudinal direction of the second conductive pattern and the longitudinal direction of the slit pattern is provided along the longitudinal direction of the second conductive pattern.

6. The power transistor module according to claim 1 ,
wherein the first conductive pattern is electrically connected with the drain electrode of at least one switching element of the plurality of the switching elements, and
wherein the second conductive pattern is electrically connected with the source electrode of at least one switching element of the plurality of the switching elements.

7. The power transistor module according to claim 1 ,
wherein the second conductive pattern is provided with the slit pattern such that when the first feeding point and the second feeding point are respectively supplied with power of different potentials and the power transistor module is actuated, a current in the opposite direction to the direction of a current flowing through the first conductive pattern is generated in the second conductive pattern.

8. The power transistor module according to claim 1 ,
wherein the second conductive pattern is provided with the slit pattern such that when the first feeding point and the second feeding point are respectively supplied with power of different potentials and the power transistor module is actuated, directions of currents respectively flowing through the first conductive pattern and the second conductive pattern are opposite to their respective adjoining currents.

9. The power transistor module according to claim 1 ,
wherein the length of the slit pattern in the longitudinal direction is such a length that when the first feeding point and the second feeding point are respectively supplied with power of different potentials and the power transistor module is actuated, a difference in the value of inductance generated in the cur

Assignees

• Hitachi Ltd

Inventors

• Masuda Toru
• Konno Akitoyo

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W90/00 Primary

  Package configurations · CPC title