Electronic device

Patent metadata

Field	Value
Publication number	US-10002816-B2
Application number	US-201515117805-A
Country	US
Kind code	B2
Filing date	Mar 18, 2015
Priority date	Mar 20, 2014
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A semiconductor integrated circuit, a radiation detection unit and a cooling unit are provided. Here, a radiation detection unit is provided near the semiconductor integrated circuit and detects a radiation quantity. The cooling unit cools the semiconductor integrated circuit according to the detected radiation quantity. In an environment where a radiation quantity is more, the generation of a malfunction can be restrained by cooling the semiconductor integrated circuit.

First claim

The invention claimed is:

1. An electronic device comprising:
a semiconductor integrated circuit;
a temperature measuring section configured to measure a temperature of the semiconductor integrated circuit;
a radiation detection unit provided near the semiconductor integrated circuit to detect a radiation quantity when the measured temperature is equal to or higher than a predetermined value; and
a cooling unit configured to cool the semiconductor integrated circuit based on the detected radiation quantity, wherein the cooling unit comprises:
a cooling device thermally connected with the semiconductor integrated circuit to absorb a heat quantity from the semiconductor integrated circuit;
a heat conductor thermally connected with the cooling device to conduct the absorbed heat quantity;
a thermal radiator thermally connected with the heat conductor to radiate the conducted heat quantity toward outside.

2. The electronic device according to claim 1 ,
wherein the cooling unit further comprises:
a cooling device control section configured to control an operation of the cooling device such that the measured temperature falls within a predetermined range.

3. The electronic device according to claim 2 , wherein the radiation detection unit comprises:
a radiation detecting section configured to detect the radiation quantity; and
a radiation detecting section control section configured to control an operation of the radiation detecting section and generate a signal indicating the detected radiation quantity to transmit to the cooling device control section.

4. A kit comprising:
a temperature measuring section configured to measure a temperature of a semiconductor integrated circuit;
a radiation detection unit provided near the semiconductor integrated circuit to detect a radiation quantity when the measured temperature is equal to or higher than a predetermined value; and
a cooling unit attached to the semiconductor integrated circuit so as to be brought into close contact with the semiconductor integrated circuit and configured to cool the semiconductor integrated circuit based on the detected radiation quantity, wherein the cooling unit comprises:
a cooling device thermally connected with the semiconductor integrated circuit to absorb a heat quantity from the semiconductor integrated circuit;
a heat conductor thermally connected with the cooling unit to conduct the absorbed heat quantity; and
a thermal radiator thermally connected with the heat conductor to radiate the conducted heat quantity toward outside.

5. The kit according to claim 4 ,
wherein the cooling unit further comprises:
a cooling device control section configured to control an operation of the cooling unit such that the measured temperature falls within a predetermined range.

6. The kit according to claim 5 , wherein the radiation detection unit comprises:
a radiation detecting section configured to detect a radiation quantity; and
a radiation detecting section control section configured to control an operation of the radiation detecting section and to generate a signal indicating the detected radiation quantity to transmit to the cooling device control section.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Matsuura Daisuke
• Kuroda Yoshikatsu
• GEMBA Kei

Classifications

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W40/28 Primary

  comprising Peltier coolers · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• B64G1/54

  Protection against radiation · CPC title

• B64G1/546

  shielding electronic equipment · CPC title