Coil device

US10002705B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10002705-B2
Application numberUS-201715804387-A
CountryUS
Kind codeB2
Filing dateNov 6, 2017
Priority dateNov 9, 2016
Publication dateJun 19, 2018
Grant dateJun 19, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is coil device 1 including: core 10 including winding core part 12 and flange parts 14 a, 14 a provided on both edges of winding core part 12 , and coil part 30 including wires 31, 32 wound on winding core part 12 . Electrode film 40 , having wire connecting part 41 where wire edges 31 a, 31 b, 32 a, 32 b are connected, and formed on a surface of the flange parts 14 a, 14 a . Metal terminal 50 is connected to a terminal fitting part 42 formed on a surface of electrode film 40 at a place different from the wire connecting part. According to the invention, a coil device having a high reliability for bonding at mounting part can be provided.

First claim

Opening claim text (preview).

The invention claimed is: 1. A coil device comprising: a core including a winding core part and a flange part provided on an edge of the winding core part, a coil part comprised of a wire wound on the winding core part, an electrode film having a wire connecting part where a wire edge of the wire is connected, and the electrode film is formed on a surface of the flange part, and a metal terminal is connected to a terminal fitting part and is formed on a surface of the electrode film at a place different from the wire connecting part, wherein the metal terminal is fixed to the flange part by an adhesion member, at a place where the electrode film is not formed. 2. The coil device according to claim 1 , further comprising a plate member having a flat external face. 3. The coil device according to claim 1 , wherein the metal terminal comprises: a mounting part faced and connected to a surface of a circuit board, and a mounting assistance part formed continuously from the mounting part. 4. The coil device according to claim 3 , wherein the mounting part is disposed opposite to the wire connecting part respectively on the opposite sides of the flange part. 5. The coil device according to claim 3 , wherein the wire connecting part is disposed adjacent to the mounting part on the same side of the flange part. 6. The coil device according to claim 5 , wherein a pair of the metal terminals are provided on the flange part, and the wire connecting part is disposed between a pair of the mounting parts respectively formed on the pair of the metal terminals.

Assignees

Inventors

Classifications

  • in the form of particles {(H01F1/346, H01F1/348 and H01F1/38 take precedence)} · CPC title

  • Magnetic cores · CPC title

  • H01F27/292Primary

    Surface mounted devices · CPC title

  • associated with surface mounted components · CPC title

  • Construction of conductive connections, of leads · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10002705B2 cover?
Provided is coil device 1 including: core 10 including winding core part 12 and flange parts 14 a, 14 a provided on both edges of winding core part 12 , and coil part 30 including wires 31, 32 wound on winding core part 12 . Electrode film 40 , having wire connecting part 41 where wire edges 31 a, 31 b, 32 a, 32 b are connected, and formed on a surface…
Who is the assignee on this patent?
Tdk Corp
What technology area does this patent fall under?
Primary CPC classification H01F27/292. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 19 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).