Copper alloy and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10002684-B2
Application number	US-201214413300-A
Country	US
Kind code	B2
Filing date	Jul 26, 2012
Priority date	Jul 26, 2012
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A copper alloy according to the present invention is a copper alloy rolled to be plate-shaped. The copper alloy contains 8.5 to 9.5 mass % of Ni, 5.5 to 6.5 mass % of Sn with a remainder being Cu and unavoidable impurities. An average diameter of crystal grains in a cross section perpendicular to a rolling direction is less than 6 μm. A ratio x/y of an average length x of the crystal grains in a plate width direction to an average length y in a plate thickness direction satisfies 1≤x/y≤2.5. An X-ray diffracted intensity ratio in a plate surface parallel to the rolling direction of the copper alloy includes, when an X-ray diffracted intensity of a (220) plane is standardized as 1, an intensity ratio of a (200) plane being 0.30 or less, an intensity ratio of a (111) plane being 0.45 or less, and an intensity ratio of a (311) plane being 0.60 or less. The intensity ratio of the (111) plane is greater than the intensity ratio of the (200) plane and smaller than the intensity ratio of the (311) plane.

First claim

The invention claimed is:

1. A copper alloy, comprising:
8.5 to 9.5 mass % of Ni,
5.5 to 6.5 mass % of Sn, and
wherein the copper alloy is rolled to be plate-shaped,
an average diameter of crystal grains in a cross section perpendicular to a rolling direction is less than 6 μm,
a ratio x/y of an average length x of the crystal grains in a plate width direction to an average length y in a plate thickness direction satisfies 1≤x/y≤2.5,
an X-ray diffracted intensity ratio in a plate surface parallel to the rolling direction of the copper alloy includes, when an X-ray diffracted intensity of a (220) plane is standardized as 1, an intensity ratio of a (200) plane being 0.30 or less, an intensity ratio of a (111) plane being 0.45 or less, and an intensity ratio of a (311) plane being 0.60 or less, and
the intensity ratio of the (111) plane is greater than the intensity ratio of the (200) plane and smaller than the intensity ratio of the (311) plane.

2. The copper alloy according to claim 1 , wherein a maximum height of surface roughness in a vertical direction with respect to the rolling direction is 0.6 μm or less.

3. The copper alloy according to claim 1 , further comprising:
a total amount of 0.1 to 1.0 mass % of two or more elements selected from the group consisting of Mn, Si and P.

4. The copper alloy according to claim 1 , wherein a number density of inclusions having a grain diameter of from 0.5 to 1 μm located at a grain boundary in a cross-section perpendicular to the rolling direction is 5×10 4 inclusions/mm 2 or less.

5. The copper alloy according to claim 2 , further comprising:
a total amount of 0.1 to 1.0 mass % of two or more elements selected from the group consisting of Mn, Si and P.

6. The copper alloy according to claim 2 , wherein a number density of inclusions having a grain diameter of from 0.5 to 1 μm located on a grain boundary in a cross-sectional organization of a plane perpendicular to the rolling direction is 5×10 4 inclusions/mm 2 or less.

7. The copper alloy according to claim 3 , wherein a number density of inclusions having a grain diameter of from 0.5 to 1 μm located on a grain boundary in a cross-sectional organization of a plane perpendicular to the rolling direction is 5×10 4 inclusions/mm 2 or less.

Assignees

• Ito Takefumi
• Maeda Chisako
• Yoshida Yuji
• Saegusa Kei
• Kemmotsu Takayuki
• Ngk Insulators Ltd

Inventors

• Ito Takefumi
• Maeda Chisako
• Yoshida Yuji
• Saegusa Kei
• Kemmotsu Takayuki

Classifications

• C22F1/08

  of copper or alloys based thereon · CPC title

• C22C9/06

  with nickel or cobalt as the next major constituent · CPC title

• C22F1/002

  by rapid cooling or quenching; cooling agents used therefor · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title