Heat storing system

Patent metadata

Field	Value
Publication number	US-10001327-B2
Application number	US-201515327055-A
Country	US
Kind code	B2
Filing date	Sep 23, 2015
Priority date	Oct 8, 2014
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A heat storing system includes: a heat source that emits heat to a first thermal medium; and a heat storing unit. The heat storing unit includes a heat storing body container housing a heat storing body, and a thermal medium container housing a liquid phase thermal medium. The heat storing body stores or emits heat in accordance with phase change of the heat storing body. The heat storing unit is configured to conduct a cold heat emission mode in which the liquid phase thermal medium and a cooling medium exchange heat in the thermal medium container to evaporate the thermal medium such that cold heat is emitted to the cooling medium.

First claim

The invention claimed is:

1. A heat storing system comprising:
a heat source that generates heat and emits the heat to a first thermal medium; and
a heat storing unit including a heat storing body storing heat, wherein:
the heat storing unit includes
a heat storing body container housing the heat storing body, and
a thermal medium container housing a liquid-state second thermal medium that is evaporated by removing heat of a third thermal medium flowing outside the thermal medium container,

the heat storing body container is configured to receive vapor of the second thermal medium generated in the thermal medium container,
the heat storing body has a pore receiving the vapor of the second thermal medium,
the heat storing body is configured to change to a solid-state first phase when the heat storing body has a temperature not more than a phase transition temperature and change to a solid-state second phase when the heat storing body has a temperature exceeding the phase transition temperature,
the heat storing body is configured to store or emit heat in accordance with phase change between the first phase and the second phase, and
the heat storing unit is configured to be switchable between
a heat storing mode to store heat of the first thermal medium in the heat storing body by heat exchange between the first thermal medium and the heat storing body in the heat storing body container, and
a cold heat emission mode to cool the third thermal medium by emitting cold heat to the third thermal medium through heat exchange between the liquid-phase second thermal medium and the third thermal medium in the thermal medium container to evaporate the second thermal medium.

2. The heat storing system according to claim 1 , wherein the heat storing unit is configured to be switchable among a hot heat emission mode in which hot heat stored in the heat storing body is emitted to a heating target, the cold heat emission mode, and the heat storing mode.

3. The heat storing system according to claim 2 , wherein the heat storing unit is configured to simultaneously conduct operation in the cold heat emission mode and operation in the hot heat emission mode.

4. The heat storing system according to claim 2 , wherein, in the hot heat emission mode, hot heat stored in the heat storing body is emitted to the heating target to heat the heating target.

5. The heat storing system according to claim 2 , wherein the heating target is air to be blown into an air conditioning target space of an air conditioner.

6. The heat storing system according to claim 1 , wherein, in the cold heat emission mode, cold heat of the third thermal medium cooled at the heat storing unit is emitted to a heat generator that generates heat.

7. The heat storing system according to claim 1 , wherein, in the cold heat emission mode, cold heat of the third thermal medium cooled at the heat storing unit is emitted to air to be blown into an air conditioning target space of an air conditioner.

8. The heat storing system according to claim 1 , wherein the heat storing body is porous vanadium dioxide.

9. The heat storing system according to claim 1 , wherein
the heat storing body is configured by a compound that includes a strongly correlated electron system compound and an inorganic compound.

10. The heat storing system according to claim 1 , wherein
the heat storing body has
a heat storing layer that is made of a strongly correlated electron system compound, and
a heat transfer part that increases a heat transfer area for the heat storing layer.

Assignees

• Denso Corp

Inventors

• Fuse Takuya
• Kouno Yasushi
• Kasamatsu Shinya

Classifications

• F28D20/02 Primary

  using latent heat · CPC title

• C09K5/02

  Materials undergoing a change of physical state when used (C09K5/16, C09K5/20 take precedence) · CPC title

• F01P3/20

  Cooling circuits not specific to a single part of engine or machine (F01P3/22 takes precedence) · CPC title

• Y02E60/142

  Cross-Sectional Technologies · mapped topic

• F28D20/0056

  using solid heat storage material (F28D20/0052 takes precedence) · CPC title