Phenolic resin composition

Patent metadata

Field	Value
Publication number	US-10000679-B2
Application number	US-201314411814-A
Country	US
Kind code	B2
Filing date	Jun 20, 2013
Priority date	Jul 5, 2012
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R 11 and R 14 independently represents a hydrogen atom or a hydroxy group; and each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group.

First claim

The invention claimed is:

1. A phenolic resin composition, comprising:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:

wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;

wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and

wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group,
wherein a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.

2. The phenolic resin composition according to claim 1 , wherein a mass ratio of a content of the phenol resin with respect to a content of the hydroxybenzene derivative (phenol resin/hydroxybenzene derivative) is from 50/50 to 70/30.

3. The phenolic resin composition according to claim 1 , wherein the epoxy resin has an epoxy equivalent weight of from 100 to 300.

4. The phenolic resin composition according to claim 1 , wherein the epoxy resin has a partial structure represented by the following Formula (IV):

wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom, a hydrocarbon group having from 1 to 10 carbon atoms, or an alkoxy group having from 1 to 10 carbon atoms.

5. The phenolic resin composition according to claim 4 , wherein the epoxy resin having the partial structure represented by Formula (IV) is a compound represented by the following Formula (V):

wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom or a hydrocarbon group having from 1 to 10 carbon atoms; and n represents an integer from 0 to 3.

6. The phenolic resin composition according to claim 1 , further comprising an inorganic filler.

7. A phenolic resin composition, comprising:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:

wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;

wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and

wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group, and
a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.

8. The phenolic resin composition according to claim 7 , wherein R 2 and R 4 in Formula (I) are hydroxy groups.

9. The phenolic resin composition according to claim 7 , wherein R 1 and R 3 in Formula (I) are hydroxy groups.

10. The phenolic resin composition according to claim 7 , wherein a mass ratio of a content of the phenol resin with respect to a content of the hydroxybenzene derivative (phenol resin/hydroxybenzene derivative) is from 50/50 to 70/30.

11. The phenolic resin composition according to claim 7 , wherein the epoxy resin has an epoxy equivalent weight of from 100 to 300.

12. The phenolic resin composition according to claim 7 , wherein the epoxy resin has a partial structure represented by the following Formula (IV):

wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom, a hydrocarbon group having from 1 to 10 carbon atoms, or an alkoxy group having from 1 to 10 carbon atoms.

13. The phenolic resin composition according to claim 12 , wherein the epoxy resin having the partial structure represented by Formula (IV) is a compound represented by the following Formula (V):

wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom or a hydrocarbon group having from 1 to 10 carbon atoms; and n represents an integer from 0 to 3.

14. The phenolic resin composition according to claim 7 , further comprising an inorganic filler.

15. A heat conductive material for an electric component, the heat conductive material comprising:
a phenolic resin composition, containing:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:

wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;

wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and

wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group,
wherein a content of the hydroxybenzene derivative is fr

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Kosugi Shinichi
• Sue Haruaki
• Takezawa Yoshitaka
• Takahashi Hiroyuki
• Hara Naoki

Classifications

• C08L61/06

  of aldehydes with phenols · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08G59/621 Primary

  Phenols · CPC title

• C08G8/36

  by etherifying · CPC title

• C08G59/688

  containing phosphorus · CPC title