Installation assembly and associated method for forming a bonded joint

Patent metadata

Field	Value
Publication number	US-10000019-B2
Application number	US-201615094422-A
Country	US
Kind code	B2
Filing date	Apr 8, 2016
Priority date	Mar 20, 2013
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.

First claim

What is claimed is:

1. An installation assembly comprising:
an installation stand; and
a carrier plate supported by the installation stand, wherein the carrier plate comprises an attachment surface configured to carry a first workpiece in a facing relationship to a second workpiece and a plurality of standoffs configured to extend outwardly from the attachment surface to define a predetermined bondline thickness between the first and second workpieces,
wherein the installation stand comprises an adjustment mechanism for controllably positioning the carrier plate relative thereto and relative to the second workpiece.

2. An installation assembly according to claim 1 wherein the plurality of standoffs are adjustable relative to the attachment surface of the carrier plate to define different predetermined bondline thicknesses.

3. An installation assembly according to claim 1 wherein the carrier plate is configured to be detached from the installation stand.

4. An installation assembly according to claim 1 wherein the installation stand comprises a plurality of feet configured to support the installation stand upon the second workpiece.

5. An installation assembly according to claim 4 further comprising a vacuum system configured to apply a vacuum between the feet and the second workpiece.

6. An installation assembly according to claim 1 wherein the carrier plate is comprised of a thermally conductive material and is configured to be heated.

7. An installation assembly comprising:
an installation stand;
carrier plate supported by the installation stand, wherein the carrier plate comprises an attachment surface configured to carry a first workpiece in a facing relationship to a second workpiece,
wherein the installation stand comprises an adjustment mechanism for controllably positioning the carrier plate to a first predefined position relative to the second workpiece so as to define a gap between the first and second workpieces and also to a second predefined position relative to the second workpiece such that a predetermined bondline thickness is defined between the patch and the second workpiece; and
a vacuum system configured to apply a vacuum both while the carrier plate is in the first predefined position and in the second predefined position.

8. An installation assembly according to claim 7 wherein the carrier plate comprises a plurality of standoffs configured to extend outwardly from the attachment surface to define the predetermined bondline thickness between the first and second workpieces in the second predefined position.

9. An installation assembly according to claim 8 wherein the plurality of standoffs are adjustable relative to the attachment surface of the carrier plate to define different predetermined bondline thicknesses.

10. An installation assembly according to claim 7 wherein the carrier plate is configured to be detached from the installation stand.

11. An installation assembly according to claim 7 wherein the installation stand comprises a plurality of feet configured to support the installation stand upon the second workpiece, and further comprising an attachment vacuum system configured to apply a vacuum between the feet and the second workpiece.

Assignees

• Boeing Co

Inventors

• Evens Michael W
• Watson Megan Nicole
• Keller Russell L
• Room Nicholas H
• Spalding John F
• Vargas Mary Helen
• Chanes James D
• Ferguson Kathy Lynn
• Hafenrichter Joseph Lawrence

Classifications

• B29C65/562

  using extra joining elements, i.e. which are not integral with the parts to be joined (using plastic snap elements B29C65/58; using plastic rivets B29C65/601) · CPC title

• B29C66/40

  General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces · CPC title

• B29C65/4835

  Heat curing adhesives · CPC title

• B29C65/48

  using adhesives {, i.e. using supplementary joining material; solvent bonding} · CPC title

• B29C73/10

  using patches sealing on the surface of the article (B29C73/14 takes precedence) · CPC title