Die cut opening for multi-layer flexible package
US-12319485-B2 · Jun 3, 2025 · US
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Young Donovan patents
Young Donovan is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Young Donovan |
| Total patents | 7 |
| First publication | Jun 23, 2016 |
| Latest publication | Jun 3, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Die cut opening for multi-layer flexible package
US-2020407140-A1 · Dec 31, 2020 · US
Die cut opening for multi-layer flexible package
US-10807779-B2 · Oct 20, 2020 · US
Die cut opening for multi-layer flexible package
US-2019193907-A1 · Jun 27, 2019 · US
Die cut opening for multi-layer flexible package
US-10273068-B2 · Apr 30, 2019 · US
Hybrid pressure sensitive adhesive
US-9421736-B2 · Aug 23, 2016 · US
Die cut opening for multi-layer flexible package
US-2016176600-A1 · Jun 23, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sonoco Dev Inc | 7 |
| Tobing Singa D | 1 |
| Reese Barry | 1 |
| Young Donovan | 1 |
| Toppan Packaging Americas Holdings Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B65D75/5855 | 6 |
| B65D75/5833 | 6 |
| B65D2575/586 | 6 |
| B65D75/5827 | 6 |
| Y10T156/1064 | 6 |