Systems and methods for reducing stress and improving surface adhesion in a die
US-2025233097-A1 · Jul 17, 2025 · US
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Xu Zhijun patents
Xu Zhijun is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Xu Zhijun |
| Total patents | 42 |
| First publication | Nov 5, 2015 |
| Latest publication | Jul 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for simulation of package configurations for generating cost optimized configurations
US-12198097-B2 · Jan 14, 2025 · US
Film in substrate for releasing z stack-up constraint
US-12027496-B2 · Jul 2, 2024 · US
Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement
US-11990395-B2 · May 21, 2024 · US
Power enhanced stacked chip scale package solution with integrated die attach film
US-11894344-B2 · Feb 6, 2024 · US
Substrate, maintenance method and display device
US-11864326-B2 · Jan 2, 2024 · US
Interconnect structure fabricated using lithographic and deposition processes
US-11742284-B2 · Aug 29, 2023 · US
Systems and methods for initial item grouping logic
US-11727354-B2 · Aug 15, 2023 · US
Systems and methods for computer-determined efficient packaging determination
US-11699128-B2 · Jul 11, 2023 · US
Substrate, maintenance method and display device
US-2022346237-A1 · Oct 27, 2022 · US
Recent patents
Latest publications not already listed above.
Power enhanced stacked chip scale package solution with integrated die attach film
US-2022230995-A1 · Jul 21, 2022 · US
Systems and methods for simulation of package configurations for generating cost optimized configurations
US-2022188759-A1 · Jun 16, 2022 · US
Systems and methods for computer-determined efficient bagging of ordered items
US-11327447-B2 · May 10, 2022 · US
Joint connection of corner non-critical to function (nctf) ball for bga solder joint reliability (sjr) enhancement
US-2022122907-A1 · Apr 21, 2022 · US
Power enhanced stacked chip scale package solution with integrated die attach film
US-11302671-B2 · Apr 12, 2022 · US
Systems and methods for simulation of package configurations for generating cost optimized configurations
US-11301804-B2 · Apr 12, 2022 · US
Systems and methods for initial item grouping logic
US-2022108271-A1 · Apr 7, 2022 · US
Film in substrate for releasing z stack-up constraint
US-2022093568-A1 · Mar 24, 2022 · US
Systems and methods for initial item grouping logic
US-11232401-B2 · Jan 25, 2022 · US
Systems and methods for responsive and automated predictive packaging acquisition
US-2021398036-A1 · Dec 23, 2021 · US
Systems and methods for responsive and automated predictive packaging acquisition
US-11138527-B2 · Oct 5, 2021 · US
Display substrate, display device and method for manufacturing display substrate
US-2021278718-A1 · Sep 9, 2021 · US
Systems and methods for initial item grouping logic
US-2021256471-A1 · Aug 19, 2021 · US
Systems and methods for responsive and automated predictive packaging acquisition
US-2021089975-A1 · Mar 25, 2021 · US
Systems and methods for simulation of package configurations for generating cost optimized configurations
US-2021090010-A1 · Mar 25, 2021 · US
Systems and methods for computer-determined efficient packaging determination
US-2021090012-A1 · Mar 25, 2021 · US
Systems and methods for computer-determined efficient bagging of ordered items
US-2021092863-A1 · Mar 25, 2021 · US
Interconnect structure fabricated using lithographic and deposition processes
US-2021057326-A1 · Feb 25, 2021 · US
Display substrate, display panel, display device and bonding method
US-10871689-B2 · Dec 22, 2020 · US
Display substrate, display panel, display device and bonding method
US-2020225545-A1 · Jul 16, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Coupang Corp | 17 |
| Intel Corp | 10 |
| Boe Technology Group Co Ltd | 8 |
| Chongqing Boe Optoelectronics Tech Co Ltd | 7 |
| Univ Macau Sci & Tech | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06Q10/087 | 13 |
| G06Q10/0832 | 13 |
| G06Q10/0875 | 11 |
| G06Q10/04 | 11 |
| G06Q10/10 | 10 |