Semiconductor device and lead frame
US-2023238309-A1 · Jul 27, 2023 · US
This page is not indexed by search engines while we improve data quality.
Wei Wu patents
Wei Wu is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wei Wu |
| Total patents | 6 |
| First publication | Jan 1, 2015 |
| Latest publication | Jul 27, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaging substrate, grid array package, and preparation method therefor
US-2023238313-A1 · Jul 27, 2023 · US
Resuming a remote debugging session using a backup node
US-10223241-B2 · Mar 5, 2019 · US
Resuming a remote debugging session using a backup node
US-2018253371-A1 · Sep 6, 2018 · US
Integrating data between different enterprise systems
US-9971818-B2 · May 15, 2018 · US
Integrating data between different enterprise systems
US-2015006556-A1 · Jan 1, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 4 |
| Diodes Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F16/252 | 2 |
| G06F11/3664 | 2 |
| G06F11/3632 | 2 |
| G06F11/3698 | 2 |
| G06F11/2041 | 2 |