Self-densifying interconnection between a high-temperature semiconductor device selected from GaN or SiC and a substrate
US-12593713-B2 · Mar 31, 2026 · US
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Wang Yuechen patents
Wang Yuechen is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Yuechen |
| Total patents | 7 |
| First publication | Oct 4, 2018 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Conductive hydrogel-based strain sensors for measuring body movements
US-2025339057-A1 · Nov 6, 2025 · US
Self-densifying nano-silver paste and a method of forming interconnect layer for high power electronics
US-2023230950-A1 · Jul 20, 2023 · US
Layered structure battery with multi-functional electrolyte
US-10879540-B2 · Dec 29, 2020 · US
Water-based conductive ink for rapid prototype in writable electronics
US-10442946-B2 · Oct 15, 2019 · US
Layered Structure Battery with Multi-Functional Electrolyte
US-2019173099-A1 · Jun 6, 2019 · US
Water-based conductive ink for rapid prototype in writable electronics
US-2018282566-A1 · Oct 4, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nano & Advanced Materials Inst Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09D11/16 | 2 |
| B41M5/0023 | 2 |
| H05K3/12 | 2 |
| C09D11/52 | 2 |
| C09D11/17 | 2 |