Solventless release coating organopolysiloxane composition and sheet-form substrate having cured release coating
US-10030169-B2 · Jul 24, 2018 · US
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Wang Yang Wayne patents
Wang Yang Wayne is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Yang Wayne |
| Total patents | 2 |
| First publication | Aug 25, 2016 |
| Latest publication | Jul 24, 2018 |
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dow Corning | 2 |
| Dow Corning (China) Holding Co Ltd | 1 |
| Dow Corning China Holding Co Ltd | 1 |
| Dow Silicones Corp | 1 |
| Dow Shanghai Holding Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09D183/04 | 2 |
| C09J7/0228 | 2 |
| C09J2483/005 | 2 |
| C09J7/401 | 2 |
| C09J7/405 | 2 |