Semiconductor device and method for manufacturing the same
US-12495589-B2 · Dec 9, 2025 · US
Wang Wenwu is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Wenwu |
| Total patents | 30 |
| First publication | Aug 18, 2016 |
| Latest publication | Dec 9, 2025 |
Publications ranked by popularity score, then publication date.
US-12495589-B2 · Dec 9, 2025 · US
US-12408395-B2 · Sep 2, 2025 · US
US-2025089305-A1 · Mar 13, 2025 · US
US-2025081530-A1 · Mar 6, 2025 · US
US-2024194737-A1 · Jun 13, 2024 · US
US-2024191168-A1 · Jun 13, 2024 · US
US-11810986-B2 · Nov 7, 2023 · US
US-2023326965-A1 · Oct 12, 2023 · US
US-11759892-B2 · Sep 19, 2023 · US
US-2023261050-A1 · Aug 17, 2023 · US
Latest publications not already listed above.
US-11476328-B2 · Oct 18, 2022 · US
US-2022308288-A1 · Sep 29, 2022 · US
US-11440254-B2 · Sep 13, 2022 · US
US-2021205929-A1 · Jul 8, 2021 · US
US-2021197460-A1 · Jul 1, 2021 · US
US-11024708-B1 · Jun 1, 2021 · US
US-2021151561-A1 · May 20, 2021 · US
US-2021151557-A1 · May 20, 2021 · US
US-2021151613-A1 · May 20, 2021 · US
US-2021125873-A1 · Apr 29, 2021 · US
US-10991877-B2 · Apr 27, 2021 · US
US-2020381540-A1 · Dec 3, 2020 · US
US-10312345-B2 · Jun 4, 2019 · US
US-10276366-B2 · Apr 30, 2019 · US
US-2018294342-A1 · Oct 11, 2018 · US
US-10062775-B2 · Aug 28, 2018 · US
US-9831089-B2 · Nov 28, 2017 · US
US-2017309736-A1 · Oct 26, 2017 · US
US-2016268124-A1 · Sep 15, 2016 · US
US-2016240382-A1 · Aug 18, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Inst Of Microelectronics Cas | 26 |
| Univ Yanshan | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D64/017 | 15 |
| H10D30/6735 | 12 |
| H10D30/6757 | 12 |
| H10D62/121 | 12 |
| H10D84/038 | 11 |