Conductive interconnection structure and manufacturing method thereof
US-2026076161-A1 · Mar 12, 2026 · US
Wang Wei Chih is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Wei Chih |
| Total patents | 1 |
| First publication | Mar 12, 2026 |
| Latest publication | Mar 12, 2026 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 1 |
| H10W20/42 | 1 |
| H10W20/089 | 1 |