Through-substrate underfill formation for an integrated circuit assembly
US-12341121-B2 · Jun 24, 2025 · US
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Wade James patents
Wade James is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wade James |
| Total patents | 5 |
| First publication | Dec 19, 2017 |
| Latest publication | Jun 24, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Machine vision for characterization based on analytical data
US-2023029474-A1 · Feb 2, 2023 · US
Insensitive munition initiation canister (IMIC)
US-11460282-B1 · Oct 4, 2022 · US
Through-substrate underfill formation for an integrated circuit assembly
US-2022181289-A1 · Jun 9, 2022 · US
Apparatus for remotely lifting a buried explosive device
US-9845229-B1 · Dec 19, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 2 |
| Us Navy | 2 |
| Dow Global Technologies Llc | 1 |
| Dept Of The Navy | 1 |
| The Us Department Of The Navy | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W99/00 | 2 |
| H10W90/734 | 2 |
| H10W90/724 | 2 |
| H10W72/07254 | 2 |
| H10W72/248 | 2 |