Wafer level packaging of microbolometer vacuum package assemblies
US-10553454-B2 · Feb 4, 2020 · US
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Vilander Scott patents
Vilander Scott is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Vilander Scott |
| Total patents | 3 |
| First publication | Aug 22, 2017 |
| Latest publication | Feb 4, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer level packaging of microbolometer vacuum package assemblies
US-2017372920-A1 · Dec 28, 2017 · US
Wafer level packaging of microbolometer vacuum package assemblies
US-9741591-B2 · Aug 22, 2017 · US
Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Flir Systems | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 3 |
| B81C1/00269 | 3 |
| B81C2203/0118 | 3 |
| H01L21/6831 | 3 |
| H01L21/50 | 3 |