Systems and methods for cooling computing device expansion modules based on airflow rates
US-11321497-B2 · May 3, 2022 · US
Tailor Dipak is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tailor Dipak |
| Total patents | 7 |
| First publication | Apr 19, 2018 |
| Latest publication | May 3, 2022 |
Publications ranked by popularity score, then publication date.
US-11321497-B2 · May 3, 2022 · US
US-2020410059-A1 · Dec 31, 2020 · US
US-10871963-B2 · Dec 22, 2020 · US
US-10663937-B2 · May 26, 2020 · US
US-2019339655-A1 · Nov 7, 2019 · US
US-2019339992-A1 · Nov 7, 2019 · US
US-2018107476-A1 · Apr 19, 2018 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lenovo Entpr Solutions Singapore Pte Ltd | 7 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| Y02D10/00 | 4 |
| G06F11/3409 | 3 |
| G06F11/3058 | 3 |
| G05B19/042 | 2 |
| G05F1/625 | 2 |