Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
US-10727151-B2 · Jul 28, 2020 · US
Stoeck Thomas is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Stoeck Thomas |
| Total patents | 1 |
| First publication | Jul 28, 2020 |
| Latest publication | Jul 28, 2020 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/726 | 1 |
| H10W74/142 | 1 |
| H10W74/114 | 1 |
| H10W74/016 | 1 |
| H10W74/00 | 1 |