Ultra-thin strain-relieving si1-xgex layers enabling iii-v epitaxy on si
US-2025366262-A1 · Nov 27, 2025 · US
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Smith Trevor patents
Smith Trevor is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Smith Trevor |
| Total patents | 1 |
| First publication | Nov 27, 2025 |
| Latest publication | Nov 27, 2025 |
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Major assignees
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| Assignee | Patents |
|---|---|
| Univ Mcmaster | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10H20/0133 | 1 |
| H01S5/3013 | 1 |
| H01S2304/04 | 1 |
| H01S5/021 | 1 |
| H10H20/818 | 1 |