Wafer manufacturing method
US-2024326165-A1 · Oct 3, 2024 · US
Shirai Hideaki is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shirai Hideaki |
| Total patents | 15 |
| First publication | Mar 26, 2015 |
| Latest publication | Oct 3, 2024 |
Publications ranked by popularity score, then publication date.
US-2024326165-A1 · Oct 3, 2024 · US
US-2024326174-A1 · Oct 3, 2024 · US
US-2024316824-A1 · Sep 26, 2024 · US
US-2024181566-A1 · Jun 6, 2024 · US
US-2024146139-A1 · May 2, 2024 · US
US-2023115673-A1 · Apr 13, 2023 · US
US-10967458-B2 · Apr 6, 2021 · US
US-2019039178-A1 · Feb 7, 2019 · US
US-10160056-B2 · Dec 25, 2018 · US
US-10035213-B2 · Jul 31, 2018 · US
Latest publications not already listed above.
US-2017326676-A1 · Nov 16, 2017 · US
US-9643893-B2 · May 9, 2017 · US
US-9333587-B2 · May 10, 2016 · US
US-9061364-B2 · Jun 23, 2015 · US
US-2015083316-A1 · Mar 26, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Denso Corp | 15 |
| Shirai Hideaki | 3 |
| Hayakawa Tsuyoshi | 2 |
| Takenaka Tomohiko | 1 |
| National Univ Corporation Saitama Univ | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K9/167 | 4 |
| B23K26/082 | 4 |
| B23K26/53 | 4 |
| B23K26/032 | 3 |
| B23K9/296 | 3 |