Semiconductor package
US-12575413-B2 · Mar 10, 2026 · US
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Shim Jongbo patents
Shim Jongbo is listed as an inventor on 90 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shim Jongbo |
| Total patents | 90 |
| First publication | Aug 18, 2015 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package
US-2026047464-A1 · Feb 12, 2026 · US
Semiconductor package
US-2026033369-A1 · Jan 29, 2026 · US
Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure
US-12512398-B2 · Dec 30, 2025 · US
Semiconductor package
US-2025349746-A1 · Nov 13, 2025 · US
Semiconductor package
US-12388029-B2 · Aug 12, 2025 · US
Semiconductor package
US-2025253254-A1 · Aug 7, 2025 · US
Semiconductor package
US-2025246585-A1 · Jul 31, 2025 · US
Semiconductor device having package on package structure and method of manufacturing the semiconductor device
US-2025201784-A1 · Jun 19, 2025 · US
Semiconductor packages having a dam structure
US-12261093-B2 · Mar 25, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor device having package on package structure and method of manufacturing the semiconductor device
US-12261157-B2 · Mar 25, 2025 · US
Semiconductor package
US-2025062172-A1 · Feb 20, 2025 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2025006720-A1 · Jan 2, 2025 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2024429110-A1 · Dec 26, 2024 · US
Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same
US-12148729-B2 · Nov 19, 2024 · US
Semiconductor package
US-2024321701-A1 · Sep 26, 2024 · US
Semiconductor package including an interposer and method of fabricating the same
US-12062605-B2 · Aug 13, 2024 · US
Semiconductor package
US-12033924-B2 · Jul 9, 2024 · US
Semiconductor package including interposer and method of manufacturing the semiconductor package
US-12021036-B2 · Jun 25, 2024 · US
Semiconductor package
US-2024128174-A1 · Apr 18, 2024 · US
Semiconductor package including a support solder ball
US-11948873-B2 · Apr 2, 2024 · US
Semiconductor chip, semiconductor device, and semiconductor package including the same
US-2024096840-A1 · Mar 21, 2024 · US
Semiconductor package and method of manufacturing
US-2024079250-A1 · Mar 7, 2024 · US
Semiconductor package and method of fabricating the same
US-2024079285-A1 · Mar 7, 2024 · US
Semiconductor packages and methods of manufacturing the semiconductor packages
US-2024063181-A1 · Feb 22, 2024 · US
Semiconductor package
US-11876083-B2 · Jan 16, 2024 · US
Semiconductor device having package on package structure and method of manufacturing the semiconductor device
US-2024014191-A1 · Jan 11, 2024 · US
Semiconductor package substrate and semiconductor package including the same
US-11854989-B2 · Dec 26, 2023 · US
Semiconductor package
US-2023402357-A1 · Dec 14, 2023 · US
Semiconductor package
US-2023361018-A1 · Nov 9, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 90 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 85 |
| H10W90/722 | 80 |
| H10W90/701 | 74 |
| H10W70/65 | 71 |
| H10W90/724 | 71 |