Lead frame, semiconductor package including the same, and method of manufacturing the lead frame
US-2025140661-A1 · May 1, 2025 · US
Ryu Hojun is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ryu Hojun |
| Total patents | 49 |
| First publication | Mar 24, 2015 |
| Latest publication | May 1, 2025 |
Publications ranked by popularity score, then publication date.
US-2025140661-A1 · May 1, 2025 · US
US-12228836-B2 · Feb 18, 2025 · US
US-11873232-B2 · Jan 16, 2024 · US
US-2023296954-A1 · Sep 21, 2023 · US
US-2023096082-A1 · Mar 30, 2023 · US
US-11550198-B2 · Jan 10, 2023 · US
US-2022214589-A1 · Jul 7, 2022 · US
US-2022179272-A1 · Jun 9, 2022 · US
US-2022169531-A1 · Jun 2, 2022 · US
US-10914555-B2 · Feb 9, 2021 · US
Latest publications not already listed above.
US-2020081311-A1 · Mar 12, 2020 · US
US-10481461-B2 · Nov 19, 2019 · US
US-10281792-B2 · May 7, 2019 · US
US-2019025665-A1 · Jan 24, 2019 · US
US-2018335281-A1 · Nov 22, 2018 · US
US-2018231856-A1 · Aug 16, 2018 · US
US-10012886-B2 · Jul 3, 2018 · US
US-9964829-B2 · May 8, 2018 · US
US-9952460-B2 · Apr 24, 2018 · US
US-2018062418-A1 · Mar 1, 2018 · US
US-9897887-B2 · Feb 20, 2018 · US
US-2018011384-A1 · Jan 11, 2018 · US
US-9753334-B2 · Sep 5, 2017 · US
US-2017219902-A1 · Aug 3, 2017 · US
US-2017219900-A1 · Aug 3, 2017 · US
US-2017178586-A1 · Jun 22, 2017 · US
US-9665066-B2 · May 30, 2017 · US
US-9651844-B2 · May 16, 2017 · US
US-9581876-B1 · Feb 28, 2017 · US
US-9575388-B2 · Feb 21, 2017 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Electronics & Telecommunications Res Inst | 32 |
| Korea Electronics Telecomm | 16 |
| Suh Dongwoo | 1 |
| Kim Sung Bock | 1 |
| Ryu Hojun | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02F1/155 | 23 |
| G02F1/157 | 12 |
| G02F2201/44 | 12 |
| G02F2001/1536 | 11 |
| G02F1/1533 | 10 |