Integrated device package lids with compliant features
US-2026090460-A1 · Mar 26, 2026 · US
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Roggeman Brian patents
Roggeman Brian is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Roggeman Brian |
| Total patents | 4 |
| First publication | Apr 6, 2017 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit package comprising a substrate and a solder joint coupled to a corner interconnect structure of the substrate to improve the reliability of the package
US-2025379134-A1 · Dec 11, 2025 · US
Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages
US-9947642-B2 · Apr 17, 2018 · US
PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN INTEGRATED CIRCUIT (IC) PACKAGES
US-2017098633-A1 · Apr 6, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 4 |
| H10W90/00 | 3 |
| H10W90/724 | 3 |
| H10W72/072 | 3 |
| H10W70/65 | 3 |