Electronic device and hinge mechanism thereof
US-12038793-B2 · Jul 16, 2024 · US
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Pai Ting-Wen patents
Pai Ting-Wen is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pai Ting-Wen |
| Total patents | 17 |
| First publication | Oct 22, 2020 |
| Latest publication | Jul 16, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic device assembly
US-11681329-B2 · Jun 20, 2023 · US
Electronic device and hinge mechanism thereof
US-2023129418-A1 · Apr 27, 2023 · US
Touch pad structure
US-11537177-B2 · Dec 27, 2022 · US
Touch pad structure
US-2022342442-A1 · Oct 27, 2022 · US
Foldable electronic device
US-11425827-B2 · Aug 23, 2022 · US
Electronic device assembly
US-2022236766-A1 · Jul 28, 2022 · US
Electronic device assembly
US-11334115-B2 · May 17, 2022 · US
Electronic device
US-11157046-B2 · Oct 26, 2021 · US
Expansion device
US-11146031-B2 · Oct 12, 2021 · US
Recent patents
Latest publications not already listed above.
Electronic device assembly
US-2021223821-A1 · Jul 22, 2021 · US
Touch pad structure
US-2021151267-A1 · May 20, 2021 · US
Touch pad structure
US-11009974-B2 · May 18, 2021 · US
Electronic device
US-2021055762-A1 · Feb 25, 2021 · US
Foldable electronic device
US-2021059059-A1 · Feb 25, 2021 · US
Touch pad structure
US-2021011565-A1 · Jan 14, 2021 · US
Expansion device
US-2020335924-A1 · Oct 22, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Acer Inc | 17 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F1/1616 | 6 |
| G06F1/1632 | 6 |
| H01R13/6205 | 6 |
| G06F3/03547 | 5 |
| H01R13/24 | 4 |