Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device
US-12568848-B2 · Mar 3, 2026 · US
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Okaniwa Masashi patents
Okaniwa Masashi is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Okaniwa Masashi |
| Total patents | 12 |
| First publication | May 20, 2021 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
US-12534559-B2 · Jan 27, 2026 · US
Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
US-12195566-B2 · Jan 14, 2025 · US
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
US-11935803-B2 · Mar 19, 2024 · US
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
US-11924979-B2 · Mar 5, 2024 · US
Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
US-2022389130-A1 · Dec 8, 2022 · US
Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
US-2022380508-A1 · Dec 1, 2022 · US
Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device
US-2022344227-A1 · Oct 27, 2022 · US
Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
US-2022332868-A1 · Oct 20, 2022 · US
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
US-2021277221-A1 · Sep 9, 2021 · US
Recent patents
Latest publications not already listed above.
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
US-2021147629-A1 · May 20, 2021 · US
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
US-2021147680-A1 · May 20, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Gas Chemical Co | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/47 | 12 |
| C08F2/44 | 12 |
| H10W74/15 | 11 |
| H10W74/012 | 11 |
| C08F222/40 | 11 |