Photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package
US-2025297129-A1 · Sep 25, 2025 · US
Nakamura Hidehiro is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nakamura Hidehiro |
| Total patents | 25 |
| First publication | Jul 14, 2016 |
| Latest publication | Sep 25, 2025 |
Publications ranked by popularity score, then publication date.
US-2025297129-A1 · Sep 25, 2025 · US
US-2025231353-A1 · Jul 17, 2025 · US
US-2025020656-A1 · Jan 16, 2025 · US
US-2024277783-A1 · Aug 22, 2024 · US
US-2024091185-A1 · Mar 21, 2024 · US
US-2020016536-A1 · Jan 16, 2020 · US
US-10456731-B2 · Oct 29, 2019 · US
US-10456743-B2 · Oct 29, 2019 · US
US-2019301754-A1 · Oct 3, 2019 · US
US-2019262795-A1 · Aug 29, 2019 · US
Latest publications not already listed above.
US-2019255509-A1 · Aug 22, 2019 · US
US-2019228844-A1 · Jul 25, 2019 · US
US-2019227071-A1 · Jul 25, 2019 · US
US-2019217242-A1 · Jul 18, 2019 · US
US-2019217241-A1 · Jul 18, 2019 · US
US-2019201832-A1 · Jul 4, 2019 · US
US-2019151821-A1 · May 23, 2019 · US
US-2019022572-A1 · Jan 24, 2019 · US
US-2018250629-A1 · Sep 6, 2018 · US
US-10035099-B2 · Jul 31, 2018 · US
US-2018021717-A1 · Jan 25, 2018 · US
US-2018017570-A1 · Jan 18, 2018 · US
US-2017014750-A1 · Jan 19, 2017 · US
US-2016220943-A1 · Aug 4, 2016 · US
US-2016199808-A1 · Jul 14, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 17 |
| Ajinomoto Kk | 6 |
| Resonac Corp | 1 |
| Kyocera Corp | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| Y02C20/40 | 17 |
| B01J20/06 | 17 |
| B01D2257/504 | 16 |
| B01D53/04 | 15 |
| B01D2253/1124 | 14 |