Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages
US-10242923-B2 · Mar 26, 2019 · US
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Murata Youko patents
Murata Youko is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Murata Youko |
| Total patents | 2 |
| First publication | Aug 9, 2018 |
| Latest publication | Mar 26, 2019 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Henkel IP & Holding GmbH | 2 |
| Henkel Ag & Co Kgaa | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/15 | 2 |
| H10W74/012 | 2 |
| H10W74/47 | 2 |
| C08L63/00 | 2 |
| C08L39/04 | 2 |