Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device
US-2026096382-A1 · Apr 2, 2026 · US
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Mori Ai patents
Mori Ai is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mori Ai |
| Total patents | 10 |
| First publication | Mar 9, 2023 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Separation system and separation method
US-2026077580-A1 · Mar 19, 2026 · US
Grinding head
US-2026077443-A1 · Mar 19, 2026 · US
Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device
US-12512335-B2 · Dec 30, 2025 · US
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US-12400995-B2 · Aug 26, 2025 · US
Semiconductor device and manufacturing method of semiconductor device
US-2025259877-A1 · Aug 14, 2025 · US
Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device
US-2024096659-A1 · Mar 21, 2024 · US
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US-2023197672-A1 · Jun 22, 2023 · US
Semiconductor device and manufacturing method of semiconductor device
US-2023187255-A1 · Jun 15, 2023 · US
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US-2023076961-A1 · Mar 9, 2023 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kioxia Corp | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W99/00 | 4 |
| B32B43/006 | 3 |
| H10P72/0414 | 3 |
| H10P50/667 | 3 |
| H10P50/283 | 3 |