Method for producing a solder bump on a substrate surface
US-11309269-B2 · Apr 19, 2022 · US
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Mermin Daniel patents
Mermin Daniel is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mermin Daniel |
| Total patents | 5 |
| First publication | Mar 22, 2018 |
| Latest publication | Apr 19, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for producing a solder bump on a substrate surface
US-2021074659-A1 · Mar 11, 2021 · US
Storage for electric cable
US-10673221-B2 · Jun 2, 2020 · US
Electric cable and winding device for such a cable
US-10207589-B2 · Feb 19, 2019 · US
Storage for electric cable
US-2018083432-A1 · Mar 22, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Commissariat Energie Atomique | 3 |
| Renault Sas | 2 |
| Commissariat A Lenergie Atomique Aux Energies Alternatives | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B65H2701/34 | 3 |
| Y02T90/14 | 3 |
| H02G11/02 | 3 |
| Y02T90/12 | 3 |
| Y02T10/7072 | 3 |