Injection molding system
US-12583163-B2 · Mar 24, 2026 · US
Maruyama Hidenobu is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Maruyama Hidenobu |
| Total patents | 58 |
| First publication | Jul 2, 2015 |
| Latest publication | Mar 24, 2026 |
Publications ranked by popularity score, then publication date.
US-12583163-B2 · Mar 24, 2026 · US
US-12570032-B2 · Mar 10, 2026 · US
US-12441036-B2 · Oct 14, 2025 · US
US-12390968-B2 · Aug 19, 2025 · US
US-12358196-B2 · Jul 15, 2025 · US
US-12285896-B2 · Apr 29, 2025 · US
US-12208544-B2 · Jan 28, 2025 · US
US-12122081-B2 · Oct 22, 2024 · US
US-12103211-B2 · Oct 1, 2024 · US
US-2024300155-A1 · Sep 12, 2024 · US
Latest publications not already listed above.
US-2024253274-A1 · Aug 1, 2024 · US
US-2024253283-A1 · Aug 1, 2024 · US
US-12049030-B2 · Jul 30, 2024 · US
US-12042965-B2 · Jul 23, 2024 · US
US-11992988-B2 · May 28, 2024 · US
US-11931933-B2 · Mar 19, 2024 · US
US-2024066776-A1 · Feb 29, 2024 · US
US-2024033985-A1 · Feb 1, 2024 · US
US-2024025081-A1 · Jan 25, 2024 · US
US-11865752-B2 · Jan 9, 2024 · US
US-11804763-B2 · Oct 31, 2023 · US
US-2023321883-A1 · Oct 12, 2023 · US
US-11742709-B2 · Aug 29, 2023 · US
US-11724427-B2 · Aug 15, 2023 · US
US-11718006-B2 · Aug 8, 2023 · US
US-11679540-B2 · Jun 20, 2023 · US
US-2023134832-A1 · May 4, 2023 · US
US-2023118860-A1 · Apr 20, 2023 · US
US-2023113479-A1 · Apr 13, 2023 · US
US-11590678-B2 · Feb 28, 2023 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Seiko Epson Corp | 56 |
| Sony Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B29C45/464 | 29 |
| B29C45/60 | 25 |
| B29C45/47 | 22 |
| B33Y30/00 | 20 |
| B29C45/74 | 19 |