Wafer dicing method
US-10658239-B2 · May 19, 2020 · US
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Lu Lihui patents
Lu Lihui is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lu Lihui |
| Total patents | 2 |
| First publication | Jun 13, 2019 |
| Latest publication | May 19, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer dicing method
US-2019181045-A1 · Jun 13, 2019 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Mfg Int Beijing Corp | 2 |
| Semiconductor Mfg Int Shanghai Corp | 2 |
| Semiconductor Mfg International Beijing Corp | 1 |
| Semiconductor Mfg International Shanghai Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/7416 | 2 |
| H10P72/7402 | 2 |
| H10P52/00 | 2 |
| H10P54/00 | 2 |
| B23K2103/50 | 2 |