Electrodeposited copper foil with a preffered orientation of (200) crystal plane and applications thereof
US-2025297396-A1 · Sep 25, 2025 · US
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Lin ya-mei patents
Lin ya-mei is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin ya-mei |
| Total patents | 5 |
| First publication | Mar 12, 2015 |
| Latest publication | Sep 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electrodeposited copper foil with a uniform matte surface
US-2025092553-A1 · Mar 20, 2025 · US
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof
US-9258900-B2 · Feb 9, 2016 · US
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof
US-9078353-B2 · Jul 7, 2015 · US
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof
US-2015068912-A1 · Mar 12, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nanya Plastics Corp | 3 |
| Dupont Electronics Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D3/38 | 5 |
| C25D1/04 | 5 |
| C25D7/0614 | 5 |
| B32B15/20 | 4 |
| H05K1/09 | 4 |