Formation method of interconnection structure of semiconductor device
US-10658234-B2 · May 19, 2020 · US
Li Yida is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Li Yida |
| Total patents | 3 |
| First publication | Feb 1, 2018 |
| Latest publication | May 19, 2020 |
Publications ranked by popularity score, then publication date.
US-10658234-B2 · May 19, 2020 · US
US-9899258-B1 · Feb 20, 2018 · US
US-2018033687-A1 · Feb 1, 2018 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 3 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D64/0112 | 3 |
| H10W20/047 | 3 |
| H10W20/40 | 3 |
| H10W20/425 | 3 |
| H10W20/056 | 3 |