Two dimensional and three dimensional primitive processing to determine a two dimensional plan
US-12555321-B1 · Feb 17, 2026 · US
Li Dawei is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Li Dawei |
| Total patents | 30 |
| First publication | Apr 26, 2018 |
| Latest publication | Feb 17, 2026 |
Publications ranked by popularity score, then publication date.
US-12555321-B1 · Feb 17, 2026 · US
US-12357175-B2 · Jul 15, 2025 · US
US-2025200873-A1 · Jun 19, 2025 · US
US-12303196-B2 · May 20, 2025 · US
US-12205483-B1 · Jan 21, 2025 · US
US-2024249393-A1 · Jul 25, 2024 · US
US-11972544-B2 · Apr 30, 2024 · US
US-11775812-B2 · Oct 3, 2023 · US
US-2022313084-A1 · Oct 6, 2022 · US
US-11430124-B2 · Aug 30, 2022 · US
Latest publications not already listed above.
US-11379695-B2 · Jul 5, 2022 · US
US-2022192488-A1 · Jun 23, 2022 · US
US-11288551-B2 · Mar 29, 2022 · US
US-2021407090-A1 · Dec 30, 2021 · US
US-2021407666-A1 · Dec 30, 2021 · US
US-11205100-B2 · Dec 21, 2021 · US
US-2021358096-A1 · Nov 18, 2021 · US
US-11176423-B2 · Nov 16, 2021 · US
US-11120306-B2 · Sep 14, 2021 · US
US-11017271-B2 · May 25, 2021 · US
US-10776609-B2 · Sep 15, 2020 · US
US-2020175384-A1 · Jun 4, 2020 · US
US-2020175362-A1 · Jun 4, 2020 · US
US-2019266388-A1 · Aug 29, 2019 · US
US-2018114334-A1 · Apr 26, 2018 · US
US-2018114101-A1 · Apr 26, 2018 · US
US-2018114098-A1 · Apr 26, 2018 · US
US-2018114332-A1 · Apr 26, 2018 · US
US-2018114099-A1 · Apr 26, 2018 · US
US-2018114100-A1 · Apr 26, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 12 |
| Topcon Corp | 7 |
| Samsung Electronics Co Ltd | 7 |
| Amazon Tech Inc | 3 |
| Kk Topcon | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06V10/82 | 14 |
| G06N20/00 | 13 |
| G06T7/70 | 13 |
| G06V30/19167 | 12 |
| G06V30/19173 | 12 |