Wafer-level methods for manufacturing uniform layers of material on optoelectronic modules
US-11171249-B2 · Nov 9, 2021 · US
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Lenart Robert patents
Lenart Robert is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lenart Robert |
| Total patents | 2 |
| First publication | Jun 4, 2020 |
| Latest publication | Nov 9, 2021 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ams Sensors Singapore Pte Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L31/0203 | 2 |
| H01L31/1876 | 2 |
| H01L31/1892 | 2 |
| B29C45/14655 | 2 |
| B29L2031/3406 | 2 |