Thickness-limited electrospray deposition
US-2025303636-A1 · Oct 2, 2025 · US
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Lei Lin patents
Lei Lin is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lei Lin |
| Total patents | 5 |
| First publication | Oct 21, 2021 |
| Latest publication | Oct 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Thickness-limited electrospray deposition
US-12343935-B2 · Jul 1, 2025 · US
Thickness-limited electrospray deposition
US-2025065563-A1 · Feb 27, 2025 · US
Thickness-limited electrospray deposition
US-12162216-B2 · Dec 10, 2024 · US
Thickness-limited electrospray deposition
US-2021323006-A1 · Oct 21, 2021 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Rutgers | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09D177/06 | 5 |
| C09D163/00 | 5 |
| C09D5/26 | 5 |
| C09D5/24 | 5 |
| B05D2601/20 | 5 |