Electrode assembly and secondary battery using same
US-2026088473-A1 · Mar 26, 2026 · US
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Lee Juhyung patents
Lee Juhyung is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Juhyung |
| Total patents | 49 |
| First publication | Nov 22, 2016 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Secondary battery electrode and electrode assemblly including secondary battery electrode
US-2026088462-A1 · Mar 26, 2026 · US
Semiconductor package
US-12557712-B2 · Feb 17, 2026 · US
Secondary battery including electrode assembly laterally inserted in case and method of manufacturing same
US-2026024897-A1 · Jan 22, 2026 · US
Secondary battery including electrode assembly laterally inserted into case, and manufacturing method thereof
US-2026005286-A1 · Jan 1, 2026 · US
Receiver for reordering reception signal
US-2025323816-A1 · Oct 16, 2025 · US
Absorbent article
US-12383441-B2 · Aug 12, 2025 · US
Grounding device for circuit breaker
US-12388242-B2 · Aug 12, 2025 · US
Electrode assembly and rechargeable battery with the same
US-2025233294-A1 · Jul 17, 2025 · US
Method and apparatus for measuring internal resistance of battery
US-2025224455-A1 · Jul 10, 2025 · US
Recent patents
Latest publications not already listed above.
Hybrid bonding apparatus
US-2025201602-A1 · Jun 19, 2025 · US
Selective photoresist application method and semiconductor package manufacturing method using the same
US-2025180994-A1 · Jun 5, 2025 · US
Printed circuit board and semiconductor package including the same
US-2025176104-A1 · May 29, 2025 · US
Electronic device and method for operating content using same
US-12242516-B2 · Mar 4, 2025 · US
Semiconductor package
US-2025070012-A1 · Feb 27, 2025 · US
3d printing apparatus and 3d printing method
US-2024367376-A1 · Nov 7, 2024 · US
3D printing apparatus and 3D printing method
US-12070903-B2 · Aug 27, 2024 · US
Absorbent article
US-2024225919-A1 · Jul 11, 2024 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2024170445-A1 · May 23, 2024 · US
Absorbent article
US-11963856-B2 · Apr 23, 2024 · US
Grounding device for circuit breaker
US-2023420923-A1 · Dec 28, 2023 · US
Semiconductor package
US-2023411259-A1 · Dec 21, 2023 · US
Absorbent article with an embossed waxed barrier
US-2023157906-A1 · May 25, 2023 · US
3d printing apparatus and 3d printing method
US-2023138834-A1 · May 4, 2023 · US
Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same
US-2023126102-A1 · Apr 27, 2023 · US
Multi-layer material for use in an absorbent article
US-11602464-B2 · Mar 14, 2023 · US
Electronic device and method for operating content using same
US-2022382788-A1 · Dec 1, 2022 · US
Semiconductor package and method of fabricating the same
US-11515262-B2 · Nov 29, 2022 · US
Absorbent article
US-2022218537-A1 · Jul 14, 2022 · US
Absorbent article with an absorbent system having an opening
US-11364158-B2 · Jun 21, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kimberly Clark Co | 22 |
| Samsung Electronics Co Ltd | 17 |
| Samsung Sdi Co Ltd | 6 |
| Lee Juhyung | 2 |
| Jo Byunggak | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| A61F13/472 | 15 |
| A61F2013/53795 | 11 |
| A61F13/51104 | 8 |
| A61F13/5116 | 8 |
| H10W90/724 | 7 |