Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus
US-2021057263-A1 · Feb 25, 2021 · US
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Lee Hakjun ` patents
Lee Hakjun ` is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Hakjun ` |
| Total patents | 1 |
| First publication | Feb 25, 2021 |
| Latest publication | Feb 25, 2021 |
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Major assignees
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| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/07232 | 1 |
| H10W95/00 | 1 |
| H10W72/0198 | 1 |
| H10W72/07141 | 1 |
| H10W72/011 | 1 |