Semiconductor Package
US-2025336857-A1 · Oct 30, 2025 · US
This page is not indexed by search engines while we improve data quality.
Lee Daehun patents
Lee Daehun is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Daehun |
| Total patents | 7 |
| First publication | Aug 24, 2017 |
| Latest publication | Oct 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package and method of manufacturing the semiconductor package
US-2025038100-A1 · Jan 30, 2025 · US
Semiconductor packages and substrates for packages
US-2024379524-A1 · Nov 14, 2024 · US
Package substrate and semiconductor package including the same
US-2024321708-A1 · Sep 26, 2024 · US
Control method of battery system, and battery control device and battery system performing the same
US-2024297497-A1 · Sep 5, 2024 · US
Battery pack
US-10923695-B2 · Feb 16, 2021 · US
Battery pack
US-2017244082-A1 · Aug 24, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 4 |
| Samsung Sdi Co Ltd | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 4 |
| Y02E60/10 | 3 |
| H10W90/734 | 3 |
| H10W90/724 | 3 |
| H10W74/15 | 3 |