Method for embedding a component in a printed circuit board
US-12501551-B2 · Dec 16, 2025 · US
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Langer Gregor patents
Langer Gregor is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Langer Gregor |
| Total patents | 23 |
| First publication | Apr 30, 2015 |
| Latest publication | Dec 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of manufacturing a metal silicide layer above a silicon carbide substrate, and semiconductor device comprising a metal silicide layer
US-12500086-B2 · Dec 16, 2025 · US
Chip with a silicon carbide substrate and an electrical contact
US-2025266259-A1 · Aug 21, 2025 · US
Method for Embedding a Component in a Printed Circuit Board
US-2025227850-A1 · Jul 10, 2025 · US
Chip with a silicon carbide substrate
US-12327727-B2 · Jun 10, 2025 · US
Method for Fabricating a Power Semiconductor Device
US-2024096842-A1 · Mar 21, 2024 · US
Method for manufacturing a contact on a silicon carbide semiconductor substrate, and silicon carbide semiconductor device
US-2024055256-A1 · Feb 15, 2024 · US
Method of manufacturing a semiconductor device
US-2024006218-A1 · Jan 4, 2024 · US
Chip with a Silicon Carbide Substrate
US-2023420257-A1 · Dec 28, 2023 · US
Process for producing an electrical contact on a silicon carbide substrate
US-11798807-B2 · Oct 24, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor device with metal silicide layer
US-2023317666-A1 · Oct 5, 2023 · US
Method of manufacturing a metal silicide layer above a silicon carbide substrate, and semiconductor device comprising a metal silicide layer
US-2023215729-A1 · Jul 6, 2023 · US
Process for Producing an Electrical Contact on a Silicon Carbide Substrate
US-2021265168-A1 · Aug 26, 2021 · US
Power Semiconductor Device and Method for Fabricating a Power Semiconductor Device
US-2021225795-A1 · Jul 22, 2021 · US
Electrical contact connection on silicon carbide substrate
US-11043383-B2 · Jun 22, 2021 · US
Method for Embedding a Component in a Printed Circuit Board
US-2020323081-A1 · Oct 8, 2020 · US
Method of embedding a component in a printed circuit board
US-10779413-B2 · Sep 15, 2020 · US
Electrical Contact Connection on Silicon Carbide Substrate
US-2019362973-A1 · Nov 28, 2019 · US
Method for the Production of an Electronic Module Having an Electronic Component Embedded Therein
US-2019221718-A1 · Jul 18, 2019 · US
Method for the production of an electronic module having an electronic component embedded therein
US-10283680-B2 · May 7, 2019 · US
Circuit board element having at least one LED
US-9903539-B2 · Feb 27, 2018 · US
Method for the Production of an Electronic Module as Well as Corresponding Electronic Module
US-2016329469-A1 · Nov 10, 2016 · US
LED Module with Circuit Board
US-2015115303-A1 · Apr 30, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 12 |
| At & S Austria Tech & Systemtechnik Ag | 7 |
| Infineon Technologies Austria Ag | 2 |
| Austria Tech & System Tech | 2 |
| Tridonic Jennersdorf Gmbh | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D64/0115 | 11 |
| H10D62/8325 | 11 |
| H10D64/62 | 11 |
| H01L21/0485 | 10 |
| H10W90/736 | 10 |