Semiconductor device including semiconductor chips stacked in a multi-layer structure by a flip-chip bonding method
US-12532562-B2 · Jan 20, 2026 · US
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Kwon Minho patents
Kwon Minho is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kwon Minho |
| Total patents | 6 |
| First publication | May 19, 2020 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Image sensor including field-effect transistors
US-2024292129-A1 · Aug 29, 2024 · US
Semiconductor device including semiconductor chips stacked in a multi-layer structure by a flip-chip bonding method
US-2023299111-A1 · Sep 21, 2023 · US
Tetracell image sensor preforming binning
US-11323640-B2 · May 3, 2022 · US
Tetracell image sensor preforming binning
US-2020314364-A1 · Oct 1, 2020 · US
Buck boost converter
US-10658930-B2 · May 19, 2020 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 5 |
| Destinpower Inc | 1 |
| Found Res & Business Seoul Nat Univ Sci & Tech | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04N25/78 | 3 |
| H04N25/60 | 3 |
| H04N25/70 | 2 |
| H04N25/46 | 2 |
| H04N25/447 | 2 |