Hyperelastic binder for printed, stretchable electronics
US-11678436-B2 · Jun 13, 2023 · US
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Kumar Rajan patents
Kumar Rajan is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kumar Rajan |
| Total patents | 7 |
| First publication | May 24, 2018 |
| Latest publication | Jun 13, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Hyperelastic binder for printed, stretchable electronics
US-2022071003-A1 · Mar 3, 2022 · US
Hyperelastic binder for printed, stretchable electronics
US-11184976-B2 · Nov 23, 2021 · US
Hyperelastic binder for printed, stretchable electronics
US-2019159337-A1 · May 23, 2019 · US
Thermoelectric material ink, thermoelectric element and thermoelectric device manufactured using the thermoelectric material ink, and method of manufacturing the thermoelectric device
US-2019035996-A1 · Jan 31, 2019 · US
Hyperelastic binder for printed, stretchable electronics
US-10143081-B2 · Nov 27, 2018 · US
Hyperelastic binder for printed, stretchable electronics
US-2018146545-A1 · May 24, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ California | 6 |
| Samsung Electronics Co Ltd | 1 |
| The Regents Of The Univ Of California A California Corporation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K2201/0314 | 6 |
| H05K1/095 | 6 |
| H05K1/0283 | 6 |
| H01M10/24 | 6 |
| H05K3/326 | 6 |