Semiconductor die carrier structure
US-2025285897-A1 · Sep 11, 2025 · US
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Ko Ping-Cheng patents
Ko Ping-Cheng is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ko Ping-Cheng |
| Total patents | 16 |
| First publication | Jan 2, 2020 |
| Latest publication | Sep 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor die carrier structure
US-12322623-B2 · Jun 3, 2025 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer
US-12255091-B2 · Mar 18, 2025 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (esd) prevention layer
US-2024087945-A1 · Mar 14, 2024 · US
Semiconductor die carrier structure
US-2024087932-A1 · Mar 14, 2024 · US
Semiconductor die carrier structure
US-11881421-B2 · Jan 23, 2024 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer
US-11854860-B2 · Dec 26, 2023 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (esd) prevention layer
US-2023077331-A1 · Mar 16, 2023 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer
US-11532499-B2 · Dec 20, 2022 · US
Apparatus for storing and transporting semiconductor elements, and method of making the same
US-11195737-B2 · Dec 7, 2021 · US
Recent patents
Latest publications not already listed above.
Semiconductor die carrier structure
US-2021217642-A1 · Jul 15, 2021 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (esd) prevention layer
US-2021202297-A1 · Jul 1, 2021 · US
Semiconductor die carrier structure
US-10964569-B2 · Mar 30, 2021 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer
US-10950485-B2 · Mar 16, 2021 · US
Semiconductor processing apparatus and method utilizing electrostatic discharge (esd) prevention layer
US-2020335386-A1 · Oct 22, 2020 · US
Semiconductor die carrier structure
US-2020006105-A1 · Jan 2, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 16 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/1928 | 16 |
| H10P74/20 | 8 |
| H10P72/3302 | 8 |
| H10P72/0466 | 8 |
| H10P72/0464 | 8 |